Thermal analysis of graphite and carbon-phenolic composites by pyrolysis-mass spectrometry

Photoresist-derived porous carbon for on-chip micro-supercapacitors

“…In our case, the thickness differences are not as large (1.1 vs. 0.95 lm for Ar vs. H 2 /Ar), but follow the same general trend. Thermogravimetric analysis and mass spectrometry undertaken during pyrolysis in high vacuum or inert environments show that much of the mass loss occurs at T < 600°C, and further carbonization occurs at higher temperatures but accounts for a small fraction of the overall mass loss [13,17,18,16]. Therefore, in our procedure, the majority of the carbonization likely proceeds primarily in an inert (Ar) environment and before H 2 is introduced.…”

“…After photoresist deposition (and optional patterning), the sample is loaded into a hot-wall CVD furnace (Thermo Scientific Lindberg Blue M), prebaked at 300°C in $1 Torr Ar (Praxair), for 30 min. This prebake is intended to drive off water and volatile solvents [16][17][18] in order to reduce the formation of macroscale gas bubbles in the film during pyrolysis. Then, the temperature is increased to 900°C in the same ambient at an approximate rate of 40°C/min.…”

Bulk graphite: materials and manufacturing process

“…The molding of mixtures affects the porosity of bulk graphite and the orientation of materials, factors that are related to the characteristics of bulk Marinkovic and Yamashita studied the phenol carbonization process and reported that water is released from 180°C, followed by carbon monoxide, carbon dioxide, methane, and hydrogen after 400°C. At around 500°C, gases are most actively decomposed and volatilized [59][60][61]. Most of these reactions end before the temperature reaches 700°C, but small traces are emitted even after 700°C in the case of very small hydrogens.…”

Synthetic resin-bonded transition-metal carbide–carbon hetero-modulus ceramics

“…The accepted scheme of the pyrolysis (thermal destruction) of phenol-formaldehyde resins during heat treatment from 150 to 1000 • C includes [27][28][29][30][31][32] :…”