Thermal analysis of integrated spiral inductors

Impact of high emissivity paint layer on circuits thermal impedance

“…The thermal impedance of the tested circuit can by presented in the form of a Nyquist plot or after mathematical mation as a thermal constant spectrum or so called structure functions. A typical measurement a semiconductor diode or transistor as temperature sensors only, or as both a heat source and Instead, in [6] the authors demonstrated the possibility of using thermographic measurements of a silicon chip temperature rise in order to obtain its thermal impedance curve. Because of low emissivity value of metallic interconnects thermographic measurements of a chip temperature rise often requires emissivity [7].…”

“…The method assumes thermal system linearity, of a Nyquist plot or after mathematical measurement approach consist heat source and a sensor [5]. Instead, in [6] the authors demonstrated the possibility of using thermographic measurements of a silicon chip Because of low emissivity value of metallic interconnects often requires to apply a paint results of thermal impedance on a 50 x 50 x 0.6 mm alumina plate, mounted heatsink, with dimensions of 53.3 x Fischer Elektronik silicon thermal o provide good heat conduction between the resistor and when preparing the test device for the use of thermal paste was ruled out, as when using it, the making it difficult to ensure repeatable measurement conditions.…”

“…The thermal impedance of the tested circuit can by presented in the for transformation as a thermal constant spectrum or so called in using a semiconductor diode or transistor as temperature sensors only Instead, in [6] the authors demonstrated the possibility of using thermographic measurements of a silicon chip temperature rise in order to obtain its thermal impedance curve. and semiconductor chip surface, thermographic measurement layer on its surface to increase its emissivity measurements.…”

Thermal measurements of integrated inductors in CMOS technology and simple 1D analytical model of heat conduction

“…At the same time, the SiO 2 layer is characterized by a much lower thermal conductivity in comparison to Si. Thus, the oxide layer constitutes also an unwanted thermal insulation layer [12]. Wire bonding is connecting the pads of each inductor with the FR4 copper coating, providing conductive path to the power supply.…”

Thermal Modeling of a Spiral Planar Inductor

“…The nature of materials used in the manufacture of electronic components, in turn requires a working temperature limit, because a poorly managed operating temperature can lead to a change of state of materials, such as degaussing of magnetic materials, or the fusion of conductive materials. Therefore, to ensure the good operation and longevity of an electronic component, the operating temperature must be well controlled [1][2][3][4][5][6].…”