2022
DOI: 10.2298/tsci210402307h
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Thermal analysis of proposed heat sink design under natural convection for the thermal management of electronics

Abstract: The rapid development in the field of electronics has led to high power densities and miniaturization of electronic packages. Because of the compact size of electronic devices, the rate of heat dissipation has increased drastically. Due to this reason, the air-cooling system with a conventional heat sink is insufficient to remove large quantity of heat. A novel macro-channel ?L-shaped heat sink? is proposed and analyzed to overcome this problem. The thermal resistance and fluid flow behavior … Show more

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Cited by 6 publications
(2 citation statements)
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“…The heat sink plays a key role in the last stage of the entire projector to diffuse heat from the heat source into the air. Therefore, factors such as the capacity of the heat sink, its thermal conductivity, the material chosen and its cost all determine its importance in the system 9 .…”
Section: Study On the Improvement Strategy Of Heat Dissipation Of Mic...mentioning
confidence: 99%
“…The heat sink plays a key role in the last stage of the entire projector to diffuse heat from the heat source into the air. Therefore, factors such as the capacity of the heat sink, its thermal conductivity, the material chosen and its cost all determine its importance in the system 9 .…”
Section: Study On the Improvement Strategy Of Heat Dissipation Of Mic...mentioning
confidence: 99%
“…It has been reported that the minimum fin top thickness and minimum draft angle for conventional aluminum alloy die casting are usually 1.8-3 mm and 1-5 • , respectively [9,21]. In various studies on heat sinks, including both experimental and numerical studies, the fin thicknesses ranged from 1-3 mm [21][22][23][24][25][26][27][28][29][30][31][32][33][34]. There are also reports that very thin fins cannot be cast using traditional die casting methods [7].…”
Section: Introductionmentioning
confidence: 99%