Thermal Analysis of the Laminated Busbar System of a Multilevel Converter

Smirnova, Liudmila; Juntunen, Raimo; Murashko, Kirill; Musikka, Tatu; Pyrhönen, Juha

doi:10.1109/tpel.2015.2420593

Cited by 34 publications

(19 citation statements)

References 27 publications

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“…A cube model is put forward in [9], as shown in Fig. 3, and the thermal resistance in each coordinate axis can be calculated with it.…”

Section: A 3d Cubical Thermal Model Of a Three-level Inverter Laminamentioning

confidence: 99%

“…From the viewpoint of heat transfer, n x R in equation (7) stands for the thermal resistance of the network, which is calculated from equation (8) with no inner thermal source [9].…”

Section: A 3d Cubical Thermal Model Of a Three-level Inverter Laminamentioning

confidence: 99%

“…Therefore, during the heat calculation of a laminated busbar, the Fourier decomposition method was introduced to extract every harmonic. This can be expressed as follows [9]:…”

Section: A 3d Cubical Thermal Model Of a Three-level Inverter Laminamentioning

confidence: 99%

“…Some studies on laminated busbars in high-power inverters have been done, among which [3], [5], [7] and [8] made enough of an electromagnetic analysis for laminated busbars, but without an accurate thermal analysis. As proposed in [9], for the laminated busbars used in high-power inverters, the main factor limiting the current carrying capability is the busbar temperature. Too high a temperature will cause damage to the insulation layers of the busbars and too low a temperature means that the busbar is oversized.…”

Section: Introductionmentioning

confidence: 99%

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Improvement on the Laminated Busbar of NPC Three-Level Inverters based on a Supersymmetric Mirror Circulation 3D Cubical Thermal Model

He¹,

Xu²,

Geng³

2016

Journal of Power Electronics

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Laminated busbars with a low stray inductance are widely used in NPC three-level inverters, even though some of them have poor performances in heat equilibrium and overvoltage suppression. Therefore, a theoretical method is in need to establish an accurate mathematical model of laminated busbars and to calculate the impedance and stray inductance of each commutation loop to improve the heat equilibrium and overvoltage suppression performance. Firstly, an equivalent circuit of a NPC three-level inverter laminated busbar was built with an analysis of the commutation processes. Secondly, on the basis of a 3D (three dimensional) cubical thermal model and mirror circulation theory, a supersymmetric mirror circulation 3D cubical thermal model was built. Based on this, the laminated busbar was decomposed in 3D space to calculate the equivalent resistance and stray inductance in each commutation loop. Finally, the model and analysis results were put into a busbar design, simulation and experiments, whose results demonstrate the accuracy and feasibility of the proposed method.

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“…A cube model is put forward in [9], as shown in Fig. 3, and the thermal resistance in each coordinate axis can be calculated with it.…”

Section: A 3d Cubical Thermal Model Of a Three-level Inverter Laminamentioning

confidence: 99%

“…From the viewpoint of heat transfer, n x R in equation (7) stands for the thermal resistance of the network, which is calculated from equation (8) with no inner thermal source [9].…”

Section: A 3d Cubical Thermal Model Of a Three-level Inverter Laminamentioning

confidence: 99%

“…Therefore, during the heat calculation of a laminated busbar, the Fourier decomposition method was introduced to extract every harmonic. This can be expressed as follows [9]:…”

Section: A 3d Cubical Thermal Model Of a Three-level Inverter Laminamentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Improvement on the Laminated Busbar of NPC Three-Level Inverters based on a Supersymmetric Mirror Circulation 3D Cubical Thermal Model

He¹,

Xu²,

Geng³

2016

Journal of Power Electronics

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“…Multi-layer laminated busbar is designed in [22] for power electronic block, with improved interconnection between the capacitor bank and the semiconductor devices and with low-stray inductance, and so with low voltage stress operation. For the laminated busbar topology optimization also enables balancing the materials consumption (especially copper) with the maximum temperature and stray inductance of the busbar [23,24]. Different plating contact surfaces have impact over the temperature distribution at busbar connection, silver plating having the lower contact resistance and lower temperature, as demonstrated in [25].…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of Busbars from a High Current Power Supply System

Pleşca

2019

Energies

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Copper busbar technology is widely used with the aim to achieve electrical connections with power distribution systems because of their flexibility and compactness. The thermal analysis takes into account the heat conduction and convection of a copper busbar system used to supply a test bench with high currents in order to check the electro-thermal behaviour of power circuit breakers during overload and short circuit conditions. This paper proposes a mathematical model for busbars used within a high current power supply. The obtained thermal model can be used to analyse the thermal behaviour of busbars in steady-state conditions at different values of the electric current, cross-section and length of the busbar. Also, the mathematical model allows to calculate the temperature distribution along the busbar at different values of the contact resistances at junction points with other conductors. There is a good correlation between calculated, simulated and experimental results.

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