Thermal Analysis on Semiconductor Laser with Non-injection Region

Sheng-nan, 王胜楠 Wang; Bao-xue, 薄报学 Bo; Liu-yang, 许留洋 Xu; Yang, 杜洋 Du; Zhong-liang, 乔忠良 Qiao; Xin, 高欣 Gao

doi:10.3788/fgxb20143508.0969

Cited by 1 publication

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“…The gap width depends on the contact area between the solder and the chip or heat sink. During the Ansys finite element simulation, in order to facilitate analysis and calculation, it is common to model the chip and its internal structure using a simplified rectangular stack structure [14][15][16][17]. The research object of this study is the F-mount packaged single emitter diode laser with a cavity length of 2 mm.…”

Section: Simulation Of F-mount Packaged Single Emittermentioning

confidence: 99%

Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages

Deng,

Li,

Wang

et al. 2024

Electronics

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The reliability of packaged laser diodes is heavily dependent on the quality of the die attach. Even a small void or delamination may result in a sudden increase in junction temperature, eventually leading to failure of the operation. The contact thermal resistance at the interface between the die attach and the heat sink plays a critical role in thermal management of high-power laser diode packages. This paper focuses on the investigation of interface contact thermal resistance of the die attach using thermal transient analysis. The structure function of the heat flow path in the T3ster thermal resistance testing experiment is utilized. By analyzing the structure function of the transient thermal characteristics, it was determined that interface thermal resistance between the chip and solder was 0.38 K/W, while the resistance between solder and heat sink was 0.36 K/W. The simulation and measurement results showed excellent agreement, indicating that it is possible to accurately predict the interface contact area of the die attach in the F-mount packaged single emitter laser diode. Additionally, the proportion of interface contact thermal resistance in the total package thermal resistance can be used to evaluate the quality of the die attach.

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Section: Simulation Of F-mount Packaged Single Emittermentioning

confidence: 99%