2021
DOI: 10.1007/s10973-020-10419-1
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Thermal analysis via horizontal solidification of Al3Cu2Si (mass%) alloy: thermal and microstructural parameters, intermetallic compounds and microhardness

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Cited by 4 publications
(1 citation statement)
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“…These methods generally lead to greater agreement with the results observed in practice. On the other hand, a large number of experimental studies have also been performed to fulfil the same objective [31][32][33][34][35][36][37][38][39][40][41][42][43][44][45][46][47][48][49][50]. Another interesting technique that has been widely used to determine the unsteady thermal variables acting during solid-liquid phase change is the inverse heat conduction problem (IHCP), which is based on a mathematical description of the physical mechanisms of the process supplemented with experimentally obtained temperature measurements in metals and/or molds.…”
Section: Introductionmentioning
confidence: 99%
“…These methods generally lead to greater agreement with the results observed in practice. On the other hand, a large number of experimental studies have also been performed to fulfil the same objective [31][32][33][34][35][36][37][38][39][40][41][42][43][44][45][46][47][48][49][50]. Another interesting technique that has been widely used to determine the unsteady thermal variables acting during solid-liquid phase change is the inverse heat conduction problem (IHCP), which is based on a mathematical description of the physical mechanisms of the process supplemented with experimentally obtained temperature measurements in metals and/or molds.…”
Section: Introductionmentioning
confidence: 99%