Thermal and dielectric properties enhancement of photocurable acrylate polymers for digital light processing 3D printed electronics

Abstract

Digital light processing 3D printing has been rapidly evolving conventional manufacturing industry with the most meticulous resolution and strongest layer-to-layer adhesion among all additive manufacturing techniques. In this study, to improve poor polymer thermal stability and dielectric properties from prevailing methyl methacrylate-based resin, tri-functional trimethylolpropane tri-acrylate (TMPTA) is introduced to form a stable polymer network. Mean-

Assisted Preparation of Waterborne Anti-etching Coating for Printed Circuit Board Photoresist Using Dibenzoyl Peroxide/Copper(II)-Phthalocyanine at Room Temperature

“…The result of Figure a that the viscosity of photoresist A-D appears to be increasing suggests the increase in the ratio of TMPTA leads to a greater degree of cross-linking between acrylic resin and TMPTA, resulting in a denser internal network structure and ultimately leading to increased photoresist viscosity . Simultaneously, the formation of hydrogen bonds between water molecules and carboxyl groups increases the resin’s viscosity. , Figure b shows that the surface tension of the photoresist increases proportionally with the TMPTA ratio, resulting in a continuous increase in its contact angle on the surface of the copper-clad laminate. It is attributed to the accumulation of ester bonds and unreacted CC from TMPTA in the resin molecules, which increases the overall polarity of the molecule and the interaction force between polymer macromolecules and water molecules.…”

“…43 Simultaneously, the formation of hydrogen bonds between water molecules and carboxyl groups increases the resin's viscosity. 44,45 Figure 4b shows that the surface tension of the photoresist increases proportionally with the TMPTA ratio, resulting in a continuous increase in its contact angle on the surface of the copper-clad laminate. It is attributed to the accumulation of ester bonds and unreacted C�C from TMPTA in the resin molecules, which increases the overall polarity of the molecule and the interaction force between polymer macromolecules and water molecules.…”

3D additive lithography for electronics towards highly integrated freeform structural electronics

“…In recent years, the integration of electronics into 3D printed devices has been receiving increasing attention. [2][3][4][5][6] Fully additive manufacturing of electronics has the potential to lower the environmental impact compared to conventional printed circuit board (PCB) manufacturing; but also allows for the freeform, three-dimensional, heterogeneous integration of components such as chips, light sources, sensors, and other functional components.…”