2018
DOI: 10.2478/msp-2018-0047
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Thermal and electrical properties of polyimide/PANI nanofiber composites prepared via in situ polymerization

Abstract: Polyimide/polyaniline nanofiber composites were prepared by in situ polymerization with various weight percentages of polyaniline (PANI) nanofibers. X-ray diffraction (XRD) and Fourier transform infrared spectra (FT-IR), proved the successful preparation of PANI nanofiber composite films. In addition, thermal stability of PI/PANI nanofiber composites was superior relative to PI, having 10 % gravimetric loss in the range of 623 °C to 671 °C and glass transition temperature of 289 °C to 297 °C. Furthermore, the … Show more

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Cited by 34 publications
(32 citation statements)
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“…Polyamide 6 (PA6), polyamide 66 (PA66), polyacrylonitrile (PAN), polyimide (PI), polyurethane (PU), polyaniline (PANI), polystyrene (PS), poly (lactide) (PLA), PI, and aramid electrospun fibers have been employed as reinforcements in polymer matrices including polyamides (PAs), poly (methyl methacrylate) (PMMA), poly (caprolactone) (PCL), PLA, PANI, thermoplastic polyurethane (TPU), poly (vinyl alcohol) (PVA), PI, melamineformaldehyde, epoxy, and dental resins. [9][10][11][12][13]19 In 1999, Kim and Reneker, 20 used poly benzimidazole nanofibers with an average diameter of 300 nm and at 3-15 wt% as reinforcement in epoxy resin and styrene butadiene rubber. They found an increase of up to 30% in modulus for both matrices although at the expense of elongation at break of SBR, which was drastically decreased to one third of that of the pristine matrix.…”
Section: Introductionmentioning
confidence: 99%
“…Polyamide 6 (PA6), polyamide 66 (PA66), polyacrylonitrile (PAN), polyimide (PI), polyurethane (PU), polyaniline (PANI), polystyrene (PS), poly (lactide) (PLA), PI, and aramid electrospun fibers have been employed as reinforcements in polymer matrices including polyamides (PAs), poly (methyl methacrylate) (PMMA), poly (caprolactone) (PCL), PLA, PANI, thermoplastic polyurethane (TPU), poly (vinyl alcohol) (PVA), PI, melamineformaldehyde, epoxy, and dental resins. [9][10][11][12][13]19 In 1999, Kim and Reneker, 20 used poly benzimidazole nanofibers with an average diameter of 300 nm and at 3-15 wt% as reinforcement in epoxy resin and styrene butadiene rubber. They found an increase of up to 30% in modulus for both matrices although at the expense of elongation at break of SBR, which was drastically decreased to one third of that of the pristine matrix.…”
Section: Introductionmentioning
confidence: 99%
“…However, adding fillers can suppress or delay the temperature at which DC conductance occurs. The dependence of DC conductivity on temperature conforms to the Arrhenius equation 3 53 :…”
Section: Dielectric Relaxation Process Of Pmps Compositesmentioning
confidence: 70%
“…In addition, the peaks observed at 914 and 1040 cm −1 are ascribed to the AlOH and SiO stretching vibrations, respectively. After the growth of PANI nanolayers, the three characteristic peaks of the PANI/clay nanocomposites at 1300, 1481, and 1568 cm −1 are attributed to the CN + stretching of secondary aromatic amines and the C═C stretching of the benzenoid and quinoid structures, respectively 36–38 . According to the literature, 39,40 the state of the intercalation and exfoliation of polymer/clay nanocomposites can be determined via changes in the clay band region (1350–750 cm −1 ).…”
Section: Resultsmentioning
confidence: 99%