2021
DOI: 10.1063/5.0069070
|View full text |Cite
|
Sign up to set email alerts
|

Thermal and hydraulic characteristics study of different dimpled micro-channel heat sinks

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2022
2022
2025
2025

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(1 citation statement)
references
References 17 publications
0
1
0
Order By: Relevance
“…Increase deamnd in energy sector motvited reserchers to conduct studies to enhance understanding on the heat transfer in many applications [39,40] .With continuous progress in the enhancement technology methods in the performance of thermal cooling and heat transfer removal, microchannel heat sink devices still play an important role in cooling devices such as thermoelectric devices that are used to cool down the electric chips of computers for example. Various studies have been conducted on the heat transfer improvement in cooling applications to further understand the physical concept of cooling in microchannels [1][2][3][4][5][6][7][8][9][10][11][12][13]. Maintaining microelectronic devices within operation temperatures is vital to protect such components.…”
Section: Introductionmentioning
confidence: 99%
“…Increase deamnd in energy sector motvited reserchers to conduct studies to enhance understanding on the heat transfer in many applications [39,40] .With continuous progress in the enhancement technology methods in the performance of thermal cooling and heat transfer removal, microchannel heat sink devices still play an important role in cooling devices such as thermoelectric devices that are used to cool down the electric chips of computers for example. Various studies have been conducted on the heat transfer improvement in cooling applications to further understand the physical concept of cooling in microchannels [1][2][3][4][5][6][7][8][9][10][11][12][13]. Maintaining microelectronic devices within operation temperatures is vital to protect such components.…”
Section: Introductionmentioning
confidence: 99%