Thermal and intrinsic stresses in single-crystal nickel films

Abstract

The thermal and intrinsic stresses in single-crystal nickel films, in the thickness range 500-3000 AA, prepared by epitaxial growth onto the (100) cleaved surfaces of NaF, LiF, NaCl and MgO have been obtained. Calculated results from ferromagnetic resonance experiments show that the magnitudes and directions of the film stresses depend on the nature of the substrate conditions and on the sequential ordering of the deposited layers. The experimental results revealed that the thermal stresses, which are elastic and isotropic in character, are larger than the intrinsic stresses and can be of either compressive or tensile type. This type of stress disappears after the film is removed from the substrate. The present results also show that there is no single model which sufficiently accounts for the magnitudes of the intrinsic stresses in the strained films.

Improvement in adhesion and decrease in stress of MgO thin films due to vapour chopping

“…Thermal stress develops because of the difference between the thermal expansion of the film and the substrate. The thermal stress was calculated by equation [11],…”

“…(2) [11] of vapour chopped and nonchopped MgO thin film is found to be 33.10, 22.40, and 12.97 × 10 7 N/m 2 for 673-573 K oxidation temperature respectively. For higher oxidation temperature thermal stress is higher.…”

Self-assembled NiO nano-wires on epitaxial Ni films

“…Most previous experimental work [12][13][14][15][16][17][18][19][20][21][22] indicates that the growth of Ni on MgO(001) at room temperature (RT) results in polycrystalline films. From these results it follows that differences in film morphology and epitaxial orientation are strongly dependent on growth parameters such as the substrate temperature, growth rate, etc.…”