Thermal and mechanical properties of Sn-Cu-Ni-XSiC composite solder

Abstract

ARTICLES YOU MAY BE INTERESTED INAbstract. The influence of ceramic addition on the Sn-Cu-Ni solder alloy on thermal and mechanical properties has been investigated. The results revealed that a small amount of SiC has not effect on typical soldering process but improved the hardness of the composite solder. Small dimples and rough surface in fracture surface show that SnCu-Ni composite solder exhibited typical ductile failure which has increased the shear strength value. Overall, it is concluded that Sn-Cu-Ni has shown superior mechanical properties by the addition of SiC particulates.