Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive

Zhu, Yujian; Chen, Haibin; Ke-min, Xue; Li, Martin; Wu, Jingshen

doi:10.1109/eptc.2013.6745724

Cited by 11 publications

(3 citation statements)

References 13 publications

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“…However, using solder materials amplifies reliability issues and limits the working temperature of the devices down to 200 • C at maximum. The brittleness of intermetallic compounds and low creep-resistance, as well as inferior thermal fatigue properties due to different thermal expansions of copper and solder materials, are some of the intrinsic issues with solders [21][22][23][24]. In this work a modified Cu clip-attach interconnect, in which Cu sinter paste was utilized, instead of solder paste, for attaching Cu clips to a directbond-copper-(DBC) substrate, is studied, in addition to fabrication and analysis of a fully printed version.…”

Section: Introductionmentioning

confidence: 99%

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

et al. 2021

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Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages.

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Section: Introductionmentioning

confidence: 99%

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

et al. 2021

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“…Additionally, the lifetime prediction method of power module has been discussed (9) , the thermal imbalance can be caused shorter lifetime. In case the conventional bonding technologies as the bondwires or ribbon bonding are used (10,11) , it can be important to consider the thermal imbalance but no study has been reported. This paper describes the bonding technology that can minimize the thermal imbalance of the RC-IGBT.…”

Section: Introductionmentioning

confidence: 99%

Minimizing Thermal Imbalance of RC-IGBT by Bonding Technology

2022

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This paper describes a bonding technology for suppressing the thermal imbalance of a reverse conducting insulated gate bipolar transistor (RC-IGBT). The thermal imbalance is a difference of the heat distribution between the IGBT and free-wheeling diode (FWD) regions operating of the RC-IGBT. The heat distribution is determined by design of each active area. The different heat distribution unexpectedly increases the maximal thermal resistance and temperature at the bonded area. In this study, the temperature-uniform effects by the bonding are calculated by simulation to reduce the difference of the heat distribution. It was found that covering the FWD region with the bonding effectively decreased the thermal imbalance. The proposed structure improved the difference of the thermal resistance by more than 74% compared to the conventional structure. Additionally, the difference in temperature at the bonded area of the proposed structure was almost zero. Finally, the highest temperature of the bonded area in the proposed structure reduced by more than 13℃ compared to the conventional structure, which is 25% higher power cycle capability.

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“…Therefore, the maximum junction temperature during power device operation can be optimized, which is a key parameter to manage in order to extend its operation life and reliability [29].…”

Section: Clip-bonding Technologymentioning

confidence: 99%

The Importance of Interconnection Technologies’ Reliability of Power Electronic Packages

Jacques¹

2017

System Reliability

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This chapter deals with the reliability of die interconnections used in plastic discrete power packages, dedicated to on-board electronic systems used in a wide range of applications such as automotive industry. A complete reliability analysis of two bonding technologies-aluminum wire and ribbon bonding-is proposed. This study is particularly focused on interconnection technologies' aging, when the package is subjected to thermal cycling or power cycling with high-temperature swings. For thermal cycling, the experimental reliability test results highlight that wire bond package aging is about 2.5 faster than the ribbon bond package. For power cycling, this acceleration factor is about 1.5. In both cases and whatever the bonding technique, the failure mechanism of the package is of a fatigue-stress nature. Many failure analysis results show wire bond lift-off. The degradation of the ribbon bond is more difficult to observe. Thermo-mechanical simulations using finite elements show a high stress concentration in the heel area. For the wire-bonding technique, the wire is subjected to repeated flexing and pulling that lead to its lift off. The ribbon-bonding process shows a higher robustness, thanks to a higher contact surface on the die, the low-loop profile and the stiffness of the ribbon.

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Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive

Cited by 11 publications

References 13 publications

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Minimizing Thermal Imbalance of RC-IGBT by Bonding Technology

The Importance of Interconnection Technologies’ Reliability of Power Electronic Packages

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