Thermal and stress characterization of various thin disk laser configurations at room temperature

Lasing and thermal characteristics of Yb:YAG/YAG composite with atomic diffusion bonding

“…While providing excellent performance benefits, the large aspect ratio of the gain medium between radial and thickness directions offers many unique challenges to the thin disk active medium. The suppression of amplified spontaneous emission (ASE) using an undoped host material has been analyzed and demonstrated [6][7][8]. In the case of bonding of index matched materials, direct bonding techniques of providing strong contact were developed in recent years, including thermal diffusion bonding [9][10][11] and surface chemical activation of optical elements [12].…”

A diode-pumped Nd:YVO4 thin disk laser with a hetero-composite gain element and dual-face cooling

“…But even in this case, cooling is hampered by the traditional (legacy) TDL design which uses single-sided cooling of one disk face bonded to copper heatsink, while the other disk side, facing the pumps and the cavity, remains uncooled. More recently, the addition of a transparent capping disk of either YAG or sapphire placed in optical contact with the gain medium has been shown to reduce localized temperature excursions in the disk under extreme pumping conditions [2] as well as to mitigate parasitic amplified spontaneous emission (ASE) [3]. Yet these capping disks perform mainly as heat spreaders across the disk face rather than true highly thermally conductive heat sinks.…”