Thermal Annealing Effect on Elastic-Plastic Behavior of Al-Si-Cu Structural Films Under Uniaxial and Biaxial Tension

Namazu, Takahiro; Fujii, Masayuki; Fujii, Hiroki; Masunishi, Kei; Tomizawa, Yasushi; Inoue, Shozo

doi:10.1109/jmems.2013.2257985

Cited by 16 publications

(17 citation statements)

References 63 publications

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“…The SCS frame is composed of four SCS springs, two hooking holes, and a through hole in the specimen section. (12)(13)(14) Then, an Al/Ni multilayer film sheet is attached onto the specimen section with glue. An in-house ternary-source direct current (dc) magnetron sputtering equipment is used for the deposition of the Al/Ni multilayer film.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Reliability of Reactively Alloyed NiAl as a Structural Material

2016

Sensors and Materials

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In this study, for the practical use of reactively alloyed NiAl as a structural material, its mechanical reliability is evaluated. An Al/Ni multilayer film is attractive as a local heat source for soldering. To investigate the difference in mechanical characteristics between as-deposited Al/ Ni multilayer films and reactively alloyed NiAl films, quasistatic uniaxial tensile tests and stress relaxation tests were conducted. A higher Young's modulus and a higher strength were obtained in the NiAl films. The films also showed better consistency under a constant applied strain. Then, four-point bending tests were carried out to examine the fracture strength of reactively bonded solder joints and to specify the fracture origin. All the joints fractured at the interface of the SnAg solder layer and the reactively alloyed NiAl layer. The durability of the reactively alloyed NiAl in the joints is discussed in the light of the grain size evaluated by electron backscatter diffraction (EBSD) analysis.

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Section: Introductionmentioning

confidence: 99%

Mechanical Reliability of Reactively Alloyed NiAl as a Structural Material

2016

Sensors and Materials

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“…The Si frame fabricated by deep reactive ion etching (DRIE) is composed mainly of two square holes in the fixed and movable parts and four Si springs supporting the movable part. (9)(10)(11) The alignment jig has two square convex structures with a slit, measuring 0.05 mm in width and 1.4 mm in depth, fabricated by wire discharge. The convex structures were put through two square holes of the Si frame before setting the Au bonding wire.…”

Section: Introductionmentioning

confidence: 99%

“…With this equipment, we characterized various thin materials, such as single and polycrystalline Si, Sirelated films, sputtered metal films, electroplated films, and polymers. (9)(10)(11)(12)(13)(14)(15)(16) The equipment consists of a piezoelectric actuator, an actuator case, a load cell, a linear variable differential transformer (LVDT), a course stage, and specimen holders with a cartridge heater. The actuator case possesses a lever to amplify the actuator elongation by a factor of 4.1 in the tensile direction.…”

Section: Introductionmentioning

confidence: 99%

Effect of Vacuum Annealing on Tensile Mechanical Characteristics of Au Bonding Wires

2016

Sensors and Materials

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In this paper, the effect of vacuum annealing on the mechanical properties of Au bonding wires is described. Au bonding wires with a diameter of 25 μm are subjected to quasi-static uniaxial tensile tests in laboratory air. The bonding wire specimens are prepared by attaching a wire to a Si frame fabricated by deep reactive ion etching (DRIE). The mean Young's modulus and 0.2% offset yield strength are 114 GPa and 354 MPa, respectively. By annealing at 100-300 °C for 10 min in vacuum, Young's modulus gradually decreases with increasing annealing temperature, whereas yield strength rapidly decreases in the annealed wires at temperatures above 200 °C. The annealing effect is discussed on the basis of the change in the number of recrystallized grains in the wires.

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“…By using electrostatic actuator or thermal actuator, tension force can be applied to Si NWs [2][3][4], C NWs [5,6], and other metallic, semiconductor, and insulator NWs [7,8]. For the micron-sized specimens like sputtered films, many types of tensile test techniques have been developed so far [9][10][11][12][13][14][15][16][17][18][19]. We have several types of mechanical testing techniques for thin films and NWs [3,4,[9][10][11][20][21][22][23].…”

Section: Introductionmentioning

confidence: 99%

“…For the micron-sized specimens like sputtered films, many types of tensile test techniques have been developed so far [9][10][11][12][13][14][15][16][17][18][19]. We have several types of mechanical testing techniques for thin films and NWs [3,4,[9][10][11][20][21][22][23]. By adopting them to evaluating size effect phenomena within the nano-millimeter size range, investigating the limit size showing its excellent mechanical characteristics is of significance, for realization of future strong MEMS components made of hard metals.…”

Section: Introductionmentioning

confidence: 99%