Thermal behavior and properties of naphthalene containing bismaleimide-triazine resins

Hwang, Hann-Jang; Wang, Chun‐Shan

doi:10.1002/(sici)1097-4628(19980523)68:8<1199::aid-app1>3.0.co;2-8

Cited by 23 publications

(16 citation statements)

References 2 publications

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“…There are similar melting endothermic peaks around 141–155°C and curing exothermic peak in the range of 230–260°C for these monomers. The general commercial BMI‐resin always has a melting temperature too close to its exothermic curing temperature leading to lower its processing window34 and its viscosity will increase rapidly to obstruct its evolution of blebs. In the contrast, the margin between the melting temperature and the initial polymerization temperature of these F‐containing BMI monomers are relatively larger, thus allowing a bigger processing window for a better fusing fluidity and processing.…”

Section: Resultsmentioning

confidence: 99%

Studies of fluorine‐containing bismaleimide resins part I: Synthesis and characteristics of model compounds

Wang

Shu

2011

J of Applied Polymer Sci

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A series of fluorine-containing bismaleimide (FBMI) monomers are synthesized by a 3-step reaction for using as the applications of low-k materials. The synthesized FBMI monomers are characterized by the 1 H, 13 C, 19 F nuclear magnetic resonance (NMR) spectroscopy and element analysis. These FBMI monomers react with free radical initiator or self-cure to prepare FBMI-polymers. All the self-curing FBMI resins have the glass transition temperatures (T g ) in the range of 128-141 C and show the 5% weight loss temperatures (T 5% ) of 235-293 C in nitrogen atmosphere. The higher heat resistance of selfcuring FBMI resin relative to FBMI-homopolymer is due to its higher crosslinking density. The FBMI resins exhibit improved dielectric properties as compared with commercial bismaleimide (BMI) resins with the dielectric constants (D k ) lower than 2.49, which is related to the low polarizability of the CAF bond and the large free volume of CF 3 groups in the polymers. Besides, the flame retardancy of all these FBMI resins could be enhanced via the introduction of Br-atom.

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Section: Resultsmentioning

confidence: 99%

Studies of fluorine‐containing bismaleimide resins part I: Synthesis and characteristics of model compounds

Wang

Shu

2011

J of Applied Polymer Sci

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“…In the microelectronics industry low permittivity and dissipation factor, good mechanical and thermal properties are required for intermetal dielectrics, especially in printed circuit board (PCB) industry [5]. Polycyanurates are interesting polymers for low constant and dissipation dielectrics [6][7][8]. In the curing reaction three cyanate ester functional groups (-OCN groups) form a triazine ring (trimerization).…”

Section: Introductionmentioning

confidence: 99%

Mechanical and dielectric properties of epoxy/dicyclopentadiene bisphenol cyanate ester/glass fabric composites

Wang¹,

Liang²,

Yan³

et al. 2008

Express Polym. Lett.

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Abstract. The impact and flexural strengths of epoxy-dicyclopentadiene bisphenol cyanate ester (EP-DCPDCE) hybrid thermoset as well as the interlaminar shear strength (ILSS) and flexural strength of the composites consisting of the hybrid thermoset and glass fabric were studied. It is found that the addition of epoxy resin (EP-51) can improve the mechanical properties, particularly, the impact strength of DCPDCE matrix and the ILSS of glass fabric reinforced composites. The improvements of the mechanical properties were obvious when the content of EP-51 is from 15 to 30 wt%. The investigations of the interphase of composites by scanning electron microscope (SEM) and dynamic mechanical analysis (DMA) confirm the improvement of mechanical properties of the composites. However the addition of EP-51 has negative effects on the thermal and dielectric property of the composites.

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“…There are different melting endothermic peaks around 137 and 205°C but a similar curing exothermic peak in the range of 220–320°C for these monomers. The melting point of PBMPP is higher than that of EBMPP due to the higher density of the benzene ring of the former relative to the latter and is too close to its exothermic curing temperature (220°C), leading to lower its processing window,27 which indicates that its viscosity will increase rapidly to obstruct its evolution of blebs. In contrast, the margin between the melting temperature (137°C) and the initial polymerization temperature (220°C) of the EBMPP monomer is relatively larger, thus allowing a bigger processing window for better fusing fluidity and processing.…”

Section: Resultsmentioning

confidence: 98%

Studies of phosphonate‐containing bismaleimide resins. I. Synthesis and characteristics of model compounds and polyaspartimides

Shu

Perng

Chin

2001

J of Applied Polymer Sci

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Two phosphonate-containing bismaleimide (BMI) [(4,4Ј-bismaleimidophenyl)phosphonate] monomers with different melting temperatures and similar curing temperatures were synthesized by reacting N-hydroxyphenylmaleimide with two kinds of dichloride-terminated phosphonic monomers. The BMI monomers synthesized were identified with 1 H-, 13 C-, and 31 P-nuclear magnetic resonance (NMR) spectroscopy and elemental analysis. The phosphonate-containing BMI monomers react with a freeradical initiator to prepare phosphonate-containing BMI polymers and also with various aromatic diamines to prepare a series of polyaspartimides as reactive flame retardants. The polymerization degrees of polyaspartimides depend on the alkalinity and nucleophility of diamines as chain extenders. Differential scanning calorimetry (DSC) and thermogravimetry analysis (TGA) were used to study the thermal properties of the phosphonate-containing BMI resins such as the melting temperature, curing temperature, glass transition temperature (T g ), and thermal resistance. All the phosphonatecontaining BMI resins, except the BMI polymers, have a T g in the range of 210 -256°C and show 5% weight loss temperatures (T 5% ) of 329 -434 and 310 -388°C in air and nitrogen atmospheres, respectively. The higher heat resistance of cured BMI resin relative to the BMI polymer is due to its higher crosslinking density. Since the recrosslinking reactions of BMI polymers and polyaspartimides occur more easily in an oxidation environment, their thermal stabilities in air are higher than are those in nitrogen gas. In addition, the thermal decomposition properties of polyaspartimides depend on the structures and compositions of both the diamine segments and the BMI segments.

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Thermal behavior and properties of naphthalene containing bismaleimide-triazine resins

Cited by 23 publications

References 2 publications

Studies of fluorine‐containing bismaleimide resins part I: Synthesis and characteristics of model compounds

Studies of fluorine‐containing bismaleimide resins part I: Synthesis and characteristics of model compounds

Mechanical and dielectric properties of epoxy/dicyclopentadiene bisphenol cyanate ester/glass fabric composites

Studies of phosphonate‐containing bismaleimide resins. I. Synthesis and characteristics of model compounds and polyaspartimides

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