Thermal boundary conductance and thermal conductivity strongly depend on nearby environment

Adnan, Khalid Zobaid; Feng, Tianli

doi:10.1103/physrevb.109.245302

Phys. Rev. B

2024

DOI: 10.1103/physrevb.109.245302

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Thermal boundary conductance and thermal conductivity strongly depend on nearby environment

Khalid Zobaid Adnan,

Tianli Feng

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2024

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Cited by 2 publications

References 82 publications

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(Ultra)wide bandgap semiconductor heterostructures for electronics cooling

Cheng,

Huang,

Sun

et al. 2024

Applied Physics Reviews

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The evolution of power and radiofrequency electronics enters a new era with (ultra)wide bandgap semiconductors such as GaN, SiC, and β-Ga2O3, driving significant advancements across various technologies. The elevated breakdown voltage and minimal on-resistance result in size-compact and energy-efficient devices. However, effective thermal management poses a critical challenge, particularly when pushing devices to operate at their electronic limits for maximum output power. To address these thermal hurdles, comprehensive studies into thermal conduction within semiconductor heterostructures are essential. This review offers a comprehensive overview of recent progress in (ultra)wide bandgap semiconductor heterostructures dedicated to electronics cooling and are structured into four sections. Part 1 summarizes the material growth and thermal properties of (ultra)wide bandgap semiconductor heterostructures. Part 2 discusses heterogeneous integration techniques and thermal boundary conductance (TBC) of the bonded interfaces. Part 3 focuses on the research of TBC, including the progress in thermal characterization, experimental and theoretical enhancement, and the fundamental understanding of TBC. Parts 4 shifts the focus to electronic devices, presenting research on the cooling effects of these heterostructures through simulations and experiments. Finally, this review also identifies objectives, challenges, and potential avenues for future research. It aims to drive progress in electronics cooling through novel materials development, innovative integration techniques, new device designs, and advanced thermal characterization. Addressing these challenges and fostering continued progress hold the promise of realizing high-performance, high output power, and highly reliable electronics operating at the electronic limits.

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(Ultra)wide bandgap semiconductor heterostructures for electronics cooling

Cheng,

Huang,

Sun

et al. 2024

Applied Physics Reviews

View full text Add to dashboard Cite

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Nonclassical Heat Transfer and Recent Progress

Su,

Wu,

Dai

et al. 2024

ASME Journal of Heat and Mass Transfer

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Heat transfer in solids has traditionally been described by Fourier's law, which assumes local equilibrium and a diffusive transport regime. However, advancements in nanotechnology and the development of novel materials have revealed non-classical heat transfer phenomena that extend beyond this traditional framework. These phenomena, which can be broadly categorized into those governed by kinetic theory and those extending beyond it, include ballistic transport, phonon hydrodynamics, coherent phonon transport, Anderson localization, and glass-like heat transfer, among others. Recent theoretical and experimental studies have focused on characterizing these non-classical behaviors using methods such as the Boltzmann transport equation, molecular dynamics, and advanced spectroscopy techniques. In particular, the dual nature of phonons, exhibiting both particle-like and wave-like characteristics, is fundamental to understanding these phenomena. This review summarizes state-of-the-art findings in the field, highlighting the importance of integrating both particle and wave models to fully capture the complexities of heat transfer in modern materials. The emergence of new research areas, such as chiral and topological phonons, further underscores the potential for advancing phonon engineering. These developments open up exciting opportunities for designing materials with tailored thermal properties and new device mechanisms, potentially leading to applications in thermal management, energy technologies, and quantum science.

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Thermal boundary conductance and thermal conductivity strongly depend on nearby environment

Cited by 2 publications

References 82 publications

(Ultra)wide bandgap semiconductor heterostructures for electronics cooling

(Ultra)wide bandgap semiconductor heterostructures for electronics cooling

Nonclassical Heat Transfer and Recent Progress

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