2014
DOI: 10.1016/j.actamat.2014.04.024
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Thermal boundary conductance between refractory metal carbides and diamond

Abstract: The Thermal Boundary Conductance (TBC) between thin films of Cr, Mo, Nb and W and diamond substrates has been measured using time domain thermoreflectance before and after a high-vacuum heat treatment at 800 o C for 2 h. While no signs of carbide formation could be detected in as-deposited layers by Scanning Transmission Electron Microscopy Energy Dispersive Xray spectroscopy (STEM-EDX) elemental analysis, the heat treatment led to partial (W, Mo) or full conversion (Cr, Nb) of the film into carbide. The measu… Show more

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Cited by 48 publications
(20 citation statements)
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References 66 publications
(72 reference statements)
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“…The fittings, that were done with a single parameter, namely, the interface thermal conductance h, are rather satisfactory. The high relevancy of h has been highlighted already by many authors [28][29][30][31][32][33]. In the case of AgSi/diamond, the fitted h is similar to that reported in Ref.…”
Section: Composites With Inclusions Of Either Diamond or Iron Particlsupporting
confidence: 87%
“…The fittings, that were done with a single parameter, namely, the interface thermal conductance h, are rather satisfactory. The high relevancy of h has been highlighted already by many authors [28][29][30][31][32][33]. In the case of AgSi/diamond, the fitted h is similar to that reported in Ref.…”
Section: Composites With Inclusions Of Either Diamond or Iron Particlsupporting
confidence: 87%
“…The research suggests that the thermal boundary conductivity is strongly affected by the interfacial carbides that have already formed at the metal-diamond interface during metal deposition [42]. The above investigation demonstrates that annealing the mixture of diamond and tungsten powder provides an effective approach to directly form a carbide layer on the diamonds.…”
Section: Thermal Properties Of the Diamond/cu Compositesmentioning
confidence: 91%
“…Indeed, as illustrated schematically in Figure 1a, the detailed structure of the interface can dramatically impact TBC, be it through an interfacial layer [whether interdiffused (16,40,133,139) or deliberately added (10, 140--142)], its roughness (41,143), or simply the substrate's chemical termination (18,126,128).…”
Section: Interfacial Bonding Strength and Stiffnessmentioning
confidence: 99%