Thermal camera for System-in-Package (SiP) technology: Transient thermal analysis based on FPGA and Finite Element Method (FEM)

Oukaira, Aziz; Said, Dhaou; Mellal, Idir; Ettahri, Ouafaa; Zbitou, Jamal; Lakhssassi, Ahmed

doi:10.1016/j.aeue.2023.154980

Cited by 3 publications

(1 citation statement)

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“…With the continuous development of integrated circuit technology, electronic products are increasingly developing in the directions of miniaturization, intelligence, high performance, and high reliability. In this process, SiP plays an important role and is widely used [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Design and Simulation of a System-in-Package Chip for Combined Navigation

Yang,

Shi,

Jin

2024

Micromachines

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This paper proposes a system-in-package combination navigation chip. We used wire bonding, chip stacking, surface mount, and other processes to integrate satellite navigation chips, inertial navigation chips, microprocessor chips, and separation devices. Finally, we realized the hardware requirements for combined navigation in a 20 mm × 20 mm chip. Further, we performed a multi-physics simulation analysis of the package design. For antenna signals, the insertion loss was greater than −1 dB@1 GHz and the return loss was less than −10 dB@1 GHz. The amplitude of these noises of the signal between the MCU and the IMU was approximately 20%, and the maximum value of the coupling coefficient between signal lines on the top surface was 13.4174%. The ninth mode of the power plane yielded a maximum voltage of 55 mV, and all power delivery networks had a DC voltage drop of less than 2%. The highest temperature in the microsystem was approximately 42 °C. These results show that our design performed well in terms of signal, power, and thermal performance.

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Section: Introductionmentioning

confidence: 99%