Thermal Challenges in Next-Generation Electronic Systems

Abstract

Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.

Oxidation Behavior of Copper at a Temperature below 300 °C and the Methodology for Passivation

“…As an example, the reported operating temperature of a central processing unit (CPU) can reach temperatures as high as 150 °C [8][9][10] . However, the oxidation behavior of copper at a temperature below 300 °C has received little attention.…”

“…Copper has been widely used as bonding wires or interconnects within many electronic components. Due to increasing component density and decreasing line width, the temperature within an electronic device may reach a temperature above 200 °C during operation [8][9][10] . In this study, the oxidation behavior of copper at 200 °C and 300 C in air is investigated.…”

Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials

“…Efficient heat removal became a critical issue for the performance and reliability of modern electronic, optoelectronic, photonic devices and systems. Thermal interface materials (TIMs), applied between heat sources and heat sinks, are essential ingredients of thermal management [2][3][4][5][6]. Conventional TIMs filled with thermally conductive particles require high volume fractions f of filler (f~50%) to achieve thermal conductivity K of the composite in the range of ~1-5 W/mK at room temperature (RT) [3][4][5][6].…”

Computer engineering: Feeling the heat

“…Increasingly, heat looms as the single largest obstacle to computing's continued advancement 1 . The problem is fundamental: the smaller and more densely packed circuits become, the hotter they get.…”