2010
DOI: 10.1016/j.icheatmasstransfer.2010.02.006
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Thermal characteristics of a resurfaced condenser and evaporator closed two-phase thermosyphon

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Cited by 86 publications
(19 citation statements)
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“…11. This method was based on Khandekar et al (2008) and Rahimi et al (2010). When the surfactant was added it caused reduced adhesion between the working fluids dropping and the metal surface and made the total surface free energy.…”
Section: The Contact Angle and Surface Tensionmentioning
confidence: 99%
“…11. This method was based on Khandekar et al (2008) and Rahimi et al (2010). When the surfactant was added it caused reduced adhesion between the working fluids dropping and the metal surface and made the total surface free energy.…”
Section: The Contact Angle and Surface Tensionmentioning
confidence: 99%
“…Because of the cylindrical spray region, the HPs are plugged through the holes on the blind plate in a regular hexagon form including one drainage hole as shown in Fig.3.Sintered water-copper HPs, water as working fluid, are adopted in the experiment. The metal powder-sintering method is implemented in the internal wall of the HPs, resulting in strong hydrophilic and hydrophobic characteristics at the hot end and cold end respectively, which helps to improve the heat transfer performance significantly [20]. The HP performance parameters and thermocouple arrangement on the HPs are shown in Table 1 There are 8magnetic valves in the water circuits to switch hot water and cold water pathways.…”
Section: System Description and Working Principle 21 Experimental Rimentioning
confidence: 99%
“…Alireza Moradikazerouni et al [11,12] investigated the effects of surface modifications on the heat sink, and the results found that different structural shapes on the heat surface have various heat transfer mechanisms. Rahimi et al [13] modified the condenser and evaporator of a thermosyphon and compared the heat performance and resistance of a modified thermosyphon at different input powers with a flat thermosyphon. They found that the average thermal performance at tested heat loads was increased by 15.27% and the average thermal resistance of the thermosyphon was decreased by 2.35 times.…”
Section: Introductionmentioning
confidence: 99%