2007
DOI: 10.1016/j.polymdegradstab.2007.01.029
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Thermal characterization and thermal degradation of poly(norbornene-2,3-dicarboxylic acid dialkyl esters) synthesized by vinyl addition polymerization

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Cited by 10 publications
(6 citation statements)
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“…The thermal properties of the resulting polymers were investigated by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) (see Table 2 and Electronic Supporting Information). TGA analyses of poly( NDF ) and poly( NDS ) revealed thermal stability ( T d 50% ) higher than 350 °C in agreement with literature data on functionalized polynorbornene (Liu et al, 2007 ). No correlation was observed between thermal stability ( T d 50% ) and degree of polymerization ( DP n ).…”
Section: Resultssupporting
confidence: 89%
“…The thermal properties of the resulting polymers were investigated by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) (see Table 2 and Electronic Supporting Information). TGA analyses of poly( NDF ) and poly( NDS ) revealed thermal stability ( T d 50% ) higher than 350 °C in agreement with literature data on functionalized polynorbornene (Liu et al, 2007 ). No correlation was observed between thermal stability ( T d 50% ) and degree of polymerization ( DP n ).…”
Section: Resultssupporting
confidence: 89%
“…[3] Metal-catalysed addition polymerisation (also called vinyl addition polymerisation) of norbornene occurs via the enchainment of the monomer double bonds, leading to saturated carbon chains with rigid bicyclic structural units that remain intact. The latter polymer chains are strongly constrained from the rotational point of view, [2] the corresponding polymer presenting a series of interesting and unique chemical and physical properties, such as high glass transition and decomposition temperatures, [4] high thermal stability, [5] high optical transparency, low moisture absorption, low optical birefringence and dielectric loss. [6] Therefore, these are desired materials for many optical and microelectronic applications, for instance, in films suitable for cover layers for liquid-crystal displays, condensers or insulators, [7] or deep UV photoresists and low dielectric constant interlevel dielectrics.…”
Section: Introductionmentioning
confidence: 99%
“…The heating rate employed were 5, 10, 15, 20 and 25 C/min, respectively. The activation energy of thermal degradation was calculated from the TGA data according to OzawaeFlynneWall method and the thermal degradation mechanism was estimated by Phadnis-Deshpande method [23].…”
Section: Characterizationmentioning
confidence: 99%
“…To estimate the apparent activation energy and thermal degradation mechanism of PBCCL, the PBCCL-3 was performed under various heating rates 5, 10, 15, 20, and 25 C /min in the range 30 to 450 C. The apparent activation energy and thermal degradation model of PBCCL were estimated by OzawaeFlynneWall method and Phadnis-Deshpande method [23], respectively.…”
Section: Thermal Degradation Kinetics Analysismentioning
confidence: 99%