2016 17th International Conference on Electronic Packaging Technology (ICEPT) 2016
DOI: 10.1109/icept.2016.7583205
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Thermal characterization of a novel 3D stacked package structure by CFD simulation

Cheng Chen
1
,
Delong Qiu
2
,
Fengze Hou
3
et al.
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Cited by 7 publications
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References 10 publications
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Experimental study of an integrated aluminum flat plate heat pipe for lightweight thermal management in electronic devices

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Applied Thermal Engineering
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Experimental study of an integrated aluminum flat plate heat pipe for lightweight thermal management in electronic devices

Bai,
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Zhao
et al. 2024
Applied Thermal Engineering
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0
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Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits

Agrawal
1
,
Huang
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,
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et al. 2017
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

Chen
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,
Wang2,
Ma3
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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