Thermal characterization of high-density interconnects: A methodolgy tested on a model coupon

Nakayama, Wataru; Koizumi, Katsuhiro; Fukue, Takashi; Ishizuka, Masaru; Nakajima, Tatsuya; Ohta, Hiroko; Matsuki, Ryuichi

doi:10.1109/itherm.2010.5501402

Cited by 5 publications

(4 citation statements)

References 13 publications

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“…In the reports by the author's group [64,65] effective thermal conductivities are derived for some typical layouts of metals in HDI. Indeed, they make only secondary contributions to heat spreading in the PCB.…”

Section: Heat Conduction In Printed Circuit Boardsmentioning

confidence: 99%

Heat in Computers: Applied Heat Transfer in Information Technology

Nakayama¹

2013

Journal of Heat Transfer

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Since the advent of modern electronics technology, heat transfer science and engineering has served in the development of computer technology. The computer as an object of heat transfer research has a unique aspect; it undergoes morphological transitions and diversifications in step with the progress of microelectronics technology. Evolution of computer's hardware manifests itself in increasing packing density of electronic circuits, modularization of circuit assemblies, and increasing hierarchical levels of system internal structures. These features are produced by the confluence of various factors; the primary factors are the pursuit of ever higher processing performance, less spatial occupancy, and higher energy utilization efficiency. The cost constraint on manufacturing also plays a crucial role in the evolution of computer's hardware. Besides, the drive to make computers ubiquitous parts of our society generates diverse computational devices. Concomitant developments in heat generation density and heat transfer paths pose fresh challenges to thermal management. In an introductoiy part of the paper, I recollect our experiences in the mainframe computers of the 1980s, where the system's morphological transition allowed the adoption of water cooling. Then, generic interpretations of the hardware evolution are attempted, which include recapturing the past experience. Projection of the evolutionary trend points to shrinking space for coolant flow, the process commonly in progress in all classes of computers today. The demand for compact packaging will rise to an extreme level in supercomputers, and present the need to refocus our research on microchannel cooling. Increasing complexity of coolant flow paths in small equipment poses a challenge to a user of computational fluid dynamics (CFD) simulation code. In highly integrated circuits the paths of electric current and heat become coupled, and coupled paths make the electricallthermal codesign an extremely challenging task. These issues are illustrated using the examples of a consumer product, a printed circuit board (PCB), and a many-core processor chip.

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Section: Heat Conduction In Printed Circuit Boardsmentioning

confidence: 99%

Heat in Computers: Applied Heat Transfer in Information Technology

Nakayama¹

2013

Journal of Heat Transfer

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“…Wilcoxon (Nakayama et al , 2010) demonstrates that for the situation of free convection in air, the heat loss from the top of the substrate is essentially negligible. In this case, the unidirectional steady‐state heat conduction equation applied to these structures gives a conservative estimate of the temperature rise using the measured thermal conductivities of the laminates shown in Table I.…”

Section: Tc Calculationsmentioning

confidence: 99%

“…A number of recent studies have modeled different applications where the TC of the dielectric material is of interest (Shankaran et al, 2010;Nakayama et al, 2010;Andonova et al, 2009). One example of such an application is a high power circuit where RF trace heating can be significant (Wilcoxon, 2004).…”

Section: Introductionmentioning

confidence: 99%

“…There has recently been increasing interest in higher z ‐axis TC, high‐frequency circuit laminate materials for applications where the heat removal path needs to be through the thickness direction of the dielectric material itself. A number of recent studies have modeled different applications where the TC of the dielectric material is of interest (Shankaran et al , 2010; Nakayama et al , 2010; Andonova et al , 2009). One example of such an application is a high power circuit where RF trace heating can be significant (Wilcoxon, 2004).…”

Section: Introductionmentioning

confidence: 99%

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Measurement of simulated active device and RF trace heating in high frequency circuit laminates

Caisse

Coonrod²,

Horn³

2011

Circuit World

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Purpose -The purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise with active components and RF trace heating. Design/methodology/approach -Temperature rise measurements were made on surface mounted chip resistors (to simulate active components) at various dissipated power levels, with and without "via farms". The RF heating temperature rise of 50 ohm microstrip transmission lines on 0.5 mm laminates was also measured by the same method. Findings -The chip resistor temperature rise correlated with the independently measured TC of the laminate materials. The use of a "via farm" substantially reduced the temperature rise in all materials, but the higher TC laminates still conferred a measurable advantage. The trace temperature rise due to RF heating correlated with both TC and DF. Research limitations/implications -It was shown that the one-dimensional heat transfer model does not accurately calculate the temperature rise due to significant in-plane heat spreading, particularly with lower TC materials. Originality/value -This paper details how temperature rise of both active components and 50 ohm transmission lines is affected by the thermal and electrical properties of the circuit laminate.

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Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Nakayama¹

2013

Journal of Electronic Packaging

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Heat conduction analysis is performed on a model system to survey the effects of geometric and thermal parameters on the temperature of an embedded heat source. A box model has the geometric characteristics of hand-held devices and has a laminar organization composed of a printed circuit board (PCB), air gap, and a system casing. Exploiting the laminar organization and thinness of the laminate an approximate solution is derived. The solution is used to produce a guide for thermal design analysts, which is concerned with the sensitivity of the heat source temperature to the effective thermal conductivity of the PCB. Numerical examples are shown for the models that have typical dimensions and material properties of actual equipment and PCB.

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Thermal characterization of high-density interconnects: A methodolgy tested on a model coupon

Cited by 5 publications

References 13 publications

Heat in Computers: Applied Heat Transfer in Information Technology

Heat in Computers: Applied Heat Transfer in Information Technology

Measurement of simulated active device and RF trace heating in high frequency circuit laminates

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

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