Thermal Characterization of LEDs Mounted on Substrates With Converging–Diverging and Diverging–Converging Channels

Chakravarthii, Dheepan M. K.; Devarajan, Mutharasu; Suvindraj, K; Choo, Chinheng

doi:10.1109/ted.2017.2713444

Cited by 12 publications

(2 citation statements)

References 33 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Lighting industry through the implementation of solid‐state lighting had gained more acceptance for the past 20 years in all aspects of lighting application at different point of need and by various devices . Solid‐state lighting technology was designed with some improved features; for example, they are more compact and rugged and have low operating power demand and high luminous flux; their colors do not wash out, thereby making them reliable for retail and display; they have long lifetime of more than 50 000 hours; they are directional to the exact point of need and designed with flexibility to be mounted in either simple or complex locations; and they are environmentally friendly .…”

Section: Introductionmentioning

confidence: 99%

Heat transfer enhancement in light‐emitting diode packaging employing different molar concentration of magnesium oxide thin films as a heat spreader

et al. 2020

Self Cite

View full text Add to dashboard Cite

To solve thermal management difficulties created by miniaturization of lightemitting diode package, magnesium oxide thin film was spin coated on the aluminum 5052-grade substrate and employed for heat spreading and improvement of the thermal path for heat removal from light-emitting diode parcel to ambient. Thickness of different films of magnesium oxide was prepared from 0.6M and 0.8M precursors to find out the effects of films thickness and molar concentrations towards perfect heat spreading. Results from X-ray diffraction (XRD) proves the MgO thin film as cubic with the crystalline orientations of (200), (220), and (222). Good results were highlighted through 20 layers (0.6M) MgO thin film in respect to its transient thermal analysis compared with other layers from 0.6M and 0.8M and bare Al substrate; this was due to its nonporous and evenly distributed particles size (56.0 nm), film thickness (301.7 nm), surface roughness (121 nm), higher thermal conductivity (26.3 W/ mK), and free from internal cracks and defects. Lower total thermal resistance (11.4 K/W), lower junction temperature (98.8 C), optimal thermal impedance (36.43 C), higher illumination from light-emitting diode, and operation within safe operating temperature range (2700-3000 K) for high-power light-emitting diodes were all recorded at 700 mA from the tested light-emitting diode mounted on 20 layers (0.6M) magnesium oxide thin film. This study consequently proved magnesium oxide thin film as an alternative heat spreader in lighting technology packaging.

show abstract

Section: Introductionmentioning

confidence: 99%

Heat transfer enhancement in light‐emitting diode packaging employing different molar concentration of magnesium oxide thin films as a heat spreader

et al. 2020

Self Cite

View full text Add to dashboard Cite

show abstract

“…Hence, it is important to develop an effective heat dissipation method to solve the above problems [9][10][11]. Many methods are available to improve the heat dissipation capability of LEDs by lowering their junction temperature.…”

Section: Introductionmentioning

confidence: 99%

Electrothermal Collaborative Cooling With Delayed Power Rail Switching Auxiliary Charging by Considering Energy Harvesting Mechanism for High-Power LEDs

Wang

Shen

Gao

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

With the development of high-power light-emitting diodes (LEDs), the heat flux density of devices has continued to increase, which in turn requires the development of increasingly effective methods of heat dissipation to control the working temperature of LEDs. Due to their impressive performance in solid refrigeration and energy harvesting, such thermoelectric devices as the thermoelectric cooler (TEC) and the thermoelectric generator (TEG) have been used to develop methods of heat dissipation that have been applied to power components and electronic devices. This paper proposes a delayed electro-thermal collaborative cooling system based on the TEC-TEG that uses the auxiliary charging technique for energy harvesting. In the designed delay circuit, two power source rails containing a TEG and a charged capacitor are switched automatically to supply energy to a TEC according to the charge of the capacitor and the discharge time of the delay circuit used for energy transmission. The results of experiments show that using our proposed scheme, the electromotive force can be increased by 21.6%, from 0.37 V to 0.45 V, in the TEG module compared with the collaborative electro-thermal cooling system without auto-delayed power rail switching. The switching time cost of the proposed system was only 0.8 s, and it could continuously supply enough electromotive force to drive the TEC and the overall cooling system. The proposed electro-thermal collaborative cooling system with delayed power rail switching and auxiliary charging can improve energy utilization and reduce device cost, which can help efficiently manage heat dissipation in high-power LEDs.

show abstract

Hotspot thermal management of silicon-based high power hetero-integration

Zhu

2023

International Journal of Heat and Mass Transfer

View full text Add to dashboard Cite

Thermal Characterization of LEDs Mounted on Substrates With Converging–Diverging and Diverging–Converging Channels

Cited by 12 publications

References 33 publications

Heat transfer enhancement in light‐emitting diode packaging employing different molar concentration of magnesium oxide thin films as a heat spreader

Heat transfer enhancement in light‐emitting diode packaging employing different molar concentration of magnesium oxide thin films as a heat spreader

Electrothermal Collaborative Cooling With Delayed Power Rail Switching Auxiliary Charging by Considering Energy Harvesting Mechanism for High-Power LEDs

Hotspot thermal management of silicon-based high power hetero-integration

Contact Info

Product

Resources

About