Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

Oliveira, Rodrigo Proença de; Cruz, Clarissa; Barros, André; Bertelli, Felipe; Spinelli, José Eduardo; Garcia, Amauri; Cheung, Noé

doi:10.1007/s10973-021-10755-w

“…The Sn was selected as the material of the protective layer for the following reasons. On the one hand, due to the moderate melting point of Sn (232 °C) and that Sn could not react with Al, [ 31 ] the liquid Sn is stable in the Al matrix during hot rolling. On the other hand, the superfluous Sn can dissolve into the Al matrix by heat treatment, thus reducing the adverse effect of soft Sn at the interface between the CF reinforcement and Al matrix.…”

Section: Resultsmentioning

confidence: 99%

Deformation Behavior of Carbon Fiber/Al Composites with Corrugated Structure for Developing the Rolling Plate

Zou

¹

,

Xu

²

,

Dong

³

et al. 2023

Adv Eng Mater

0

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Herein, a rolling strategy for carbon fiber (CF)/Al composites is proposed, that is, by constructing a corrugated structure of Sn‐protected CFs ([CF@Sn]≈Al composites), to realize the cooperative extension of woven CFs with Al matrix deformation in the rolling process. The matching extension feasibility and structural optimization of (CF@Sn]≈Al composites are calculated based on the designed 3D numerical model of rolling system. The [CF@Sn]≈Al composites have successfully combined excellent mechanical properties while meeting the extension design of the CF reinforcement. Mechanical testing of the samples indicates that the tensile strength of the [CF@Sn]≈Al composites increases by 18.6% while the bending strength is more than 23.2% higher than that of the rolled Al matrix. The present work provides an effective method for developing the deformed CF/Al composites as rolling plate in lightweight applications.

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Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications

Zhang

¹

,

Guang

²

,

Cao

³

2022

Adv Materials Inter

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Rapid advancements in nanotechnologies for energy conversion and transport applications urgently require a further understanding of interfacial thermal transport and enhancement of interfacial thermal conductance (ITC). Sandwiching an intermediate material between two materials has led to a new insight on enhancing electron and phonon transportation, and is enabling the possible regulation of ITC, which has attracted increasing interest over the past decades. Herein, this strategy is named as thermal bonding, following the terminology of mechanical bonding and electrical bonding in microelectronics. The authors systematically summarize the interfacial thermal transport enhanced by thermal bonding from the category of interfacial thermal transport mechanisms, thermal bonding materials (TBMs), related applications, and potential challenges. Especially, the influence factors of interfacial heat transfer are highlighted, from three points, including interaction forces (van der Waals force, hydrogen bond, covalent bond, and metal bond), electron density, and phonon vibration density of states. The authors also outline and classify TBMs into metal bonding materials, organic bonding materials, and inorganic nonmetal bonding materials. As a novel and promising interface science and engineering field, it is believed that thermal bonding strategy will provide scientists and engineers more inspiration to understand interfacial thermal transport and solve the interfacial thermal challenges.

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Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys

Eid,

Fawzy,

Mansour

et al. 2024

J Therm Anal Calorim

0

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The diminutive additions of nickel (Ni) element have been fused to Sn-1.5Ag-0.5 mass% Cu (SAC155) lead-free solder alloy. The study was examined experimentally and computationally (using JMatPro software program) the microstructural features, thermal behavior, density, thermal diffusivity, and conductivity as well as tensile stress strain of the Sn-1.5Ag-0.5Cu-x mass %Ni (x = 0.00, 0.05, 0.10, 0.20, and 0.50) solder alloys (SAC155-xNi). The fusing additions of Ni have a little impact on the melting point of SAC155 alloy which increasing from 502 to $$504.2 K$$ 504.2 K . The microstructure of SAC155 solder alloy included coarse grains of β-Sn besides, large eutectic regions, and embedded IMCs of Ag3Sn and Cu6Sn5. The computed values of Gibbs free energy (G) during solidification of the β-Sn phase, Ag3Sn, and Sn3Sn4 IMCs show the stability at $$- 130.7 \times 10^{3} {\text{J}}{\text{.kg}}^{ - 1}$$ - 130.7 × 10 3 J .kg - 1 , $$- 157.7 \times 10^{3} {\text{J}}{\text{.kg}}^{ - 1}$$ - 157.7 × 10 3 J .kg - 1 , and $$- 377.13 \times 10^{3} {\text{J}}{\text{.kg}}^{ - 1}$$ - 377.13 × 10 3 J .kg - 1 , respectively. The SAC155-xNi alloys involved finer β-Sn grains, large fibrous eutectic regions, (Cu,Ni)6Sn5 and (Cu,Ni)3Sn4 IMCs. The G of Cu6Sn5 decreased from $$- 233.1 \times 10^{3} {\text{J}}{\text{.kg}}^{ - 1}$$ - 233.1 × 10 3 J .kg - 1 to $$- 317.9 \times 10^{3} {\text{ J}}{\text{.kg}}^{ - 1}$$ - 317.9 × 10 3 J .kg - 1 when Ni content increased up to 0.25 mass %, then stable and steady at $$- 318.4 \times 10^{3} {\text{J}}{\text{.kg}}^{ - 1}$$ - 318.4 × 10 3 J .kg - 1 with more addition of Ni element. The formation of the (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 IMCs is motivated by the lowest Gibbs free energy, especially when Ni mass% is added to a sufficient level. The measured and computed values of specific heat at constant pressure (Cp) of SAC155-xNi alloys show a good matching especially at lower temperatures and a little mismatch at high temperatures which decreases with increasing Ni content. The activation energy of atomic arrangement (Q) increased from 11.36 to $$13.41 {\text{kJ}}{\text{.mole}}^{ - 1}$$ 13.41 kJ .mole - 1 with increasing Ni content in SAC155-xNi alloys. Thermal diffusivity (α) and conductivity (κ) of SAC155-xNi gradually decreased with increasing temperature in the range from 303 to 423 K and/or Ni content in alloys. The measured values of (κ) are slightly lower than the computed value at similar temperatures of the SAC155-xNi alloys. The decrease in (κ) may be assigned to scattering the electrons or reducing the phonon contributions due to the presence of various solute atoms and different IMCs. The results of stress-strain graphs reveal the enhancement of YS and UTS for all Ni-containing alloys. The improvement of the yield stress (YS) and ultimate tensile strength (UTS) of Ni-containing alloys is attributed to the uniform distribution of the IMCs, the reduction of β-Sn grain size, and the smoothed enlargement of the eutectic region.

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Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth

Cited by 8 publications

References 50 publications

Deformation Behavior of Carbon Fiber/Al Composites with Corrugated Structure for Developing the Rolling Plate

Deformation Behavior of Carbon Fiber/Al Composites with Corrugated Structure for Developing the Rolling Plate

Bonding‐Enhanced Interfacial Thermal Transport: Mechanisms, Materials, and Applications

Microstructural Examination and Thermodynamic Analysis of Sn-1.5Ag-0.5Cu-x mass% Ni Lead-Free Solder Alloys

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