Thermal conductance measurements of bolted copper to copper joints at sub-Kelvin temperatures

Didschuns, I.; Woodcraft, A.; Bintley, Dan; Hargrave, Peter Charles

doi:10.1016/j.cryogenics.2003.11.010

Cited by 33 publications

(14 citation statements)

References 18 publications

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“…This effect must be taken into account in the above methods in order to obtain accurate results at the lowest temperatures. Since the base temperature thermometer reading remains almost constant between consecutive temperature data points, we were able to estimate and remove this effect following the work of Didschuns et al [50]. Kellaris et al provide an additional discussion of the analysis methods used in this paper [22].…”

Section: Thermal Conductivity Measurementsmentioning

confidence: 99%

Properties of selected structural and flat flexible cabling materials for low temperature applications

et al. 2019

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We present measurements of the low temperature thermal conductivity for materials useful in the construction of cryogenic supports for scientific instrumentation and in the fabrication of flat flexible cryogenic cabling. The materials we measure have relatively low thermal conductivity. We present a method for measuring the heat transfer coefficient of flat cabling and show, using an example, that the thermal conductivity of a flex cable is reasonably well predicted by composing the thermal conductivities of its constituent material layers. Room temperature physical and mechanical data is given for the materials studied, as well as an overview of relevant materials science and manufacturing details. Materials include Timet Ti 15-3 and Ti 21S, Materion alloy vit105 (LM105) in amorphous state, ATI Metals Nb-47Ti, Johnson Matthey nitinol (NiTi), Mersen graphite grade 2020, DuPont Pyralux coverlay and Vespel SCP-5050, and Fralock Cirlex polyimide sheets. All data is in the temperature range 0.05 to 2 K, and up to 5 K for SCP-5050. Absolute thermometer uncertainty is ±0.007 K for Nb-47Ti, ±0.02 K for NiTi and ±0.05 K for the other samples.

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Section: Thermal Conductivity Measurementsmentioning

confidence: 99%

Properties of selected structural and flat flexible cabling materials for low temperature applications

et al. 2019

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“…• Joint conductance results relied on electrical resistivity measurements and the use of the Wiedemann-Franz Law, whose use across joints was questioned in Nilles [2] and Didschuns [4].…”

Section: Literature Reviewmentioning

confidence: 99%

Thermal conductance measurements of bolted copper joints for SuperCDMS

et al. 2015

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Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Results obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

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“…In this case, pressure was applied by mechanical devices at low temperatures. Copper demountable joints investigated by Didschuns et al [21] also displayed the same pressure dependence; they were gold plated, and hence not quantitatively comparable to the samples considered here. Electrical resistance measurements were performed by several groups.…”

Section: Data Summary and Conclusionmentioning

confidence: 53%