2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2017
DOI: 10.1109/therminic.2017.8233820
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Thermal conduction in novel isotropic conductive adhesive

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(4 citation statements)
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“…However, this effect alone can not explain the large discrepancies observed between the transient and steady state methods. Kristiansen et al 21 pointed out that the large discrepancy in the values reported by SS method occur for 45 and 50AgPS, which is above the percolation threshold. The increased thermal conductivity measured by SS method could be due to the fixed bond line thickness (BLT) between the reference bodies during curing of the AgPS-ICA sample, which exerts a contact pressure on the sample due to thermal expansion.…”
Section: Resultsmentioning
confidence: 96%
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“…However, this effect alone can not explain the large discrepancies observed between the transient and steady state methods. Kristiansen et al 21 pointed out that the large discrepancy in the values reported by SS method occur for 45 and 50AgPS, which is above the percolation threshold. The increased thermal conductivity measured by SS method could be due to the fixed bond line thickness (BLT) between the reference bodies during curing of the AgPS-ICA sample, which exerts a contact pressure on the sample due to thermal expansion.…”
Section: Resultsmentioning
confidence: 96%
“…Also shown in Fig. 4 are thermal conductivity measurements of the same AgPS-ICA from Kristiansen et al 21 by the SS method and the LF method. In the SS method, the sample is cured at different thicknesses between two Cu rods, and measuring the thermal conductivity as κ = Q/∇T , where Q is the heat flow through the sample and ∇T is the temperature gradient across the sample.…”
Section: Resultsmentioning
confidence: 99%
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