“…3D network-like fillers can overcome the drawbacks of filler aggregation and reduces ITR of the matrix-filler and filler-filler and thus provide a more stable 3D thermal transport network that significantly enhances κ c [ 10 ]. The spatial confining forced network assembly (SCFNA) technique was adopted to composites containing 3D network structure that high κ c as shown in Figure 7 [ 54–56 ]. Figure 6.…”
Section: Theoretical Aspects Of Thermal Conductivity In Polymer Compomentioning
confidence: 99%
“… Figure 6. Modes of thermal transport in polymer composites systems incorporated with different filler dimensions (a) 0D fillers, (b) 1D fillers, (c) 2D fillers, (d) 3D fillers [ 54 ] Figure 7. Schematics of self-assembled and forced assembled thermal conductive networks prepared by traditional compounding and spatial confining forced network assembly methods..‘Reprinted from Ref [ 57 ].…”
Section: Theoretical Aspects Of Thermal Conductivity In Polymer Compomentioning
The low thermal conductivity of polymers is a barrier to their use in applications requiring high thermal conductivity such as electronic packaging, heat exchangers, and thermal management devices. Polyolefins represent about 55 percent of global thermoplastic production, and therefore improving their thermal conductivity is essential for many applications. This review analyzes the advances in enhancing the thermal conductivity of polyolefin composites. First, the mechanisms of thermal transport in polyolefin composites and the key parameters that govern conductive heat transfer through the interface between the matrix and the filler are discussed. Then the advantage with different thermally conductive fillers are reviewed and analyzed. Finally, the key challenges and future directions for developing thermally enhanced polyolefin composites are outlined.
“…3D network-like fillers can overcome the drawbacks of filler aggregation and reduces ITR of the matrix-filler and filler-filler and thus provide a more stable 3D thermal transport network that significantly enhances κ c [ 10 ]. The spatial confining forced network assembly (SCFNA) technique was adopted to composites containing 3D network structure that high κ c as shown in Figure 7 [ 54–56 ]. Figure 6.…”
Section: Theoretical Aspects Of Thermal Conductivity In Polymer Compomentioning
confidence: 99%
“… Figure 6. Modes of thermal transport in polymer composites systems incorporated with different filler dimensions (a) 0D fillers, (b) 1D fillers, (c) 2D fillers, (d) 3D fillers [ 54 ] Figure 7. Schematics of self-assembled and forced assembled thermal conductive networks prepared by traditional compounding and spatial confining forced network assembly methods..‘Reprinted from Ref [ 57 ].…”
Section: Theoretical Aspects Of Thermal Conductivity In Polymer Compomentioning
The low thermal conductivity of polymers is a barrier to their use in applications requiring high thermal conductivity such as electronic packaging, heat exchangers, and thermal management devices. Polyolefins represent about 55 percent of global thermoplastic production, and therefore improving their thermal conductivity is essential for many applications. This review analyzes the advances in enhancing the thermal conductivity of polyolefin composites. First, the mechanisms of thermal transport in polyolefin composites and the key parameters that govern conductive heat transfer through the interface between the matrix and the filler are discussed. Then the advantage with different thermally conductive fillers are reviewed and analyzed. Finally, the key challenges and future directions for developing thermally enhanced polyolefin composites are outlined.
“…In order to increase their thermal properties, thermally conductive fillers are mixed [23]. When these fillers are dispersed into a higher weight percentage, they form a proper thermally conductive network that helps in phonon transfer during heat treatment [24]. Ironically, the intrinsic value of the filler material can never be attained due to the phonon scattering occurring at the interfacial surface between the filler and matrix.…”
Section: Thermal Propertiesmentioning
confidence: 99%
“…Hence, Si-µ-AlN/n-AlN/PSA has comparatively lower thermal conductivity than the Si-µ-AlN/PSA. transfer during heat treatment [24]. Ironically, the intrinsic value of the filler material can never be attained due to the phonon scattering occurring at the interfacial surface between the filler and matrix.…”
Thermal interface materials (TIMs) are very crucial for better heat-transfer in electronics working as an interfacial connection between heat generators and heat sinks. This study is focused on the pressure-sensitive acrylic adhesive tape reinforced with micron-sized and nano-sized aluminum nitride (AlN) particles where the surface modification of AlN particles is done using (3-Aminopropyl) triethoxysilane (3-APTES). The physicochemical analysis of the silanized AlN particles is done using FTIR spectroscopy and scanning electron microscopy (SEM). Furthermore, thermal properties along with thermal conductivity and thermal diffusion are also studied. The main outcome of this study shows that the sample containing surface-treated AlN particles exhibits better thermal conductivity than that of the samples containing µ and nano-sized of AlN due to the comparatively better interactions with the matrix.
“…Nevertheless, PI composites with metals or carbon materials possessed undesirable dielectric properties. Ceramic materials, such as Al 2 O 3, AlN, BN, SiC , and Si 3 N 4, have been used as fillers to improve thermal conductivity in PI composites. For example, Sombel et al investigated the thermally conductive differences of h‐BN/PI and w‐BN/PI composites and 0.56 W/m K at 29.2 vol% fillers was reported for h‐BN/PI composites.…”
Polyimide (PI) composites with mixed fillers of BN flakes and SiC whiskers exhibit enhanced thermal conductivity and mechanical properties. In order to improve dispersion and interaction of these mixed fillers within the PI matrix, BN flakes were modified by a titanate coupling agent while SiC whiskers were oxidized at 750 C for 60 minutes to produce SiC@SiO 2 followed by silane coupling agent modification. PI composites reached a maximum thermal conductivity of 0.95 W/m K at volume fraction of mixed fillers of 27.6 vol% when the weight ratio of BN flakes to SiC@SiO 2 whiskers was 1:4. The enhanced thermal conductivity is likely attributed to the formation of heat conductive networks constructed by BN flakes and SiC@SiO 2 whiskers and the improved interfacial affinity between fillers and matrix. The optimized Nielsen-mold confirms the distribution and morphology of fillers affect the thermal conductivity of PI composites. In addition, SiC whiskers enhanced the mechanical property of PI composites and the influence of fillers on the mechanical property was further elaborated.
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