Thermal conductive properties of a semiconductor laser on a polymer interposer

Thermal modelling of transfer‐bonded thin‐film gallium arsenide laser diode

“…A laser is required for high density heat assisted magnetic recording and directly integrating within the device within the read–write head would simplify the packaging requirements and ease scaling to very large volumes. There is also desire to integrate lasers onto polymer [1], glass and ceramic substrates to support applications such as photonic integrated circuits, flexible, large‐scale integrated electronics [2, 3], wearable electronics and for conformal bio‐compatible sensors [4, 5]. In some of these applications, there is a requirement to remove the native substrate due to reasons of limited space.…”