“…3 However, epoxy resins are poor heat conductors with a heat conduction coefficient of only 0.2-0.4 W m À1 k À1 , which cannot meet the heat-dissipation requirements of modern electronics. 4,5 A simple and common method is to introduce high thermal conductivity llers into the matrix, including oxides (Al 2 O 3 , SiO 2 , ZnO), [6][7][8] carbide (SiC), 9 nitrides (AlN, BN, Si 3 N 4 ) 10,11 and carbon materials (graphene, graphite, diamond, carbon ber). [12][13][14][15][16][17] Among the diverse carbon materials, graphene attracts a great deal of attention owing to its fascinating physical properties.…”