Thermal conductivity and thermal diffusivity of silicone - poly(styrelene butadiene) rubber blends from 60 to 300 K

Bhowmick, T.; Gupta, B. R.; Pattanayak, Shibabrata

doi:10.1016/0011-2275(92)90293-j

Cited by 10 publications

(11 citation statements)

References 6 publications

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“…To our knowledge, only few studies were devoted to thermal properties of rubber compounds. 22 –26 In this work, the thermophysical and the mechanical measurements of composites of NR filled with TiO 2 and silica nanoparticles were carried out at room temperature. The effect of particle size and filler content on the thermal conductivity, diffusivity, tensile strength and dynamic modulus of the composites was investigated.…”

Section: Introductionmentioning

confidence: 99%

Thermophysical and mechanical properties of TiO₂ and silica nanoparticle-filled natural rubber composites

Meera

Tlili

Boudenne

et al. 2012

Journal of Elastomers & Plastics

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The mechanical and thermophysical properties of natural rubber filled with titanium dioxide (TiO2) and nanosilica composites have been investigated at room temperature for several filler concentrations. It is observed that the thermal conductivity and thermal diffusivity of the composites increase with filler loading, independent of the nature of the filler. We show that the thermal heat transport through composites is affected by the geometry of the fillers as well as the particle size and specific surface area of the fillers. The measured values of thermal conductivity have been compared to some theoretical models. The mechanical properties of the composites have also been studied and results have been correlated with thermal conductivity data.

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Section: Introductionmentioning

confidence: 99%

Thermophysical and mechanical properties of TiO₂ and silica nanoparticle-filled natural rubber composites

Meera

Tlili

Boudenne

et al. 2012

Journal of Elastomers & Plastics

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“…In the present investigation the milling behavior of BIMS and its blends with EPDM was investigated over a range of friction ratios and temperatures and the results were analyzed in terms of the theoretical model developed by Tokita10 and Bhowmick et al11–14 In addition, an attempt was made to optimize the mill parameters, to obtain a smooth and regular band. The conclusions from the investigation are as follows: Milling behavior of BIMS changes from a loose nervy band to a tight elastic band, as the temperature of the rolls increased from 30°C to 90°C.…”

Section: Discussionmentioning

confidence: 99%

“…(1), the two factors ( R 0 / t p U − ) and (2 H 0 / t p U − ) contain no material properties, but only machine parameters. Following Tokita10 and Bhowmick et al11–14 , substituting for t p in these expressions one obtains From the right side of eqs. (3) and (4), the following dimensionless numbers may be defined as where N 1 and N 2 are known as the mill band‐formation indices (MBI), which are of practical importance and provide the information on the conditions for the band formation on the front roll as well as the switchover of the band from the front roll to the back roll during the milling operation.…”

Section: Introductionmentioning

confidence: 98%

Mill processability of brominated isobutylene‐co‐paramethylstyrene and its blends with EPDM

Kumar

et al. 2001

J of Applied Polymer Sci

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Milling behavior of brominated isobutylene-co-paramethylstyrene (BIMS) and its blends with ethylene propylene diene terpolymer (EPDM) rubber, was investigated over a range of temperatures and friction ratios in a drop mill operation. BIMS showed striking changes, that is, from a loose nervy band to a tight elastic band, as the temperature of the rolls was increased from 30°C to 90°C. For EPDM a loose band was observed at all temperatures and friction ratios studied. For the blends of BIMS and EPDM, the milling behavior changed from a tight elastic band to a loose bagging band on increasing the EPDM content. The critical nip gap (CNG), at which the front-to-back roll (F-B) transition occurred, was also measured. BIMS showed a much higher value of CNG than that of EPDM, indicating that the former had a significantly higher tendency for F-B transition than the latter material. For different blends of BIMS and EPDM, the CNG decreased on increasing the EPDM content, indicating a decrease in the tendency for F-B transition. The results were explained in terms of the rubber-tometal adhesion and the viscosity of the polymers.

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“…On the one hand, the thermal parameters of the materials are considered constant whatever the temperature. However, the thermal conductivity and the specific heat capacity are parameters that can depend on the temperature [28][29][30][31]. On the other hand, it is assumed that the convection coefficient is constant whatever the temperature.…”

Section: Thermal Behaviormentioning

confidence: 99%

Bond graph multi-physics modeling of encapsulating materials in power electronic modules

Trajin

Vidal

2020

Eur. Phys. J. Appl. Phys.

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This paper focuses on multi-physics modeling of encapsulating gels in power electronic modules for transient and steady-state simulation. With the emergence of wide-bandgap semiconductors such as SiC or GaN, operating at a higher temperature than conventional Si power chips, this passive element of the packaging appears as a few studied element sensitive to thermal and mechanical stresses. A thermo-mechanical coupled modeling of the material, based on bond graph representation, is presented. This approach allows to establish, under the same formalism, an analogy between the different physical domains. From this analogy, a multi-physical nonlinear state space representation is built, allowing transient simulation of the thermo-mechanical behavior of the material. This way of modeling and simulating is particularly adapted for a preliminary study during the upstream phases of design of the power electronic modules. It quickly establishes the maximum temperature and mechanical strains experienced by the gel.

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Thermal conductivity and thermal diffusivity of silicone - poly(styrelene butadiene) rubber blends from 60 to 300 K

Cited by 10 publications

References 6 publications

Thermophysical and mechanical properties of TiO₂ and silica nanoparticle-filled natural rubber composites

Thermophysical and mechanical properties of TiO₂ and silica nanoparticle-filled natural rubber composites

Mill processability of brominated isobutylene‐co‐paramethylstyrene and its blends with EPDM

Bond graph multi-physics modeling of encapsulating materials in power electronic modules

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Thermal conductivity and thermal diffusivity of silicone - poly(styrelene butadiene) rubber blends from 60 to 300 K

Cited by 10 publications

References 6 publications

Thermophysical and mechanical properties of TiO2 and silica nanoparticle-filled natural rubber composites

Thermophysical and mechanical properties of TiO2 and silica nanoparticle-filled natural rubber composites

Mill processability of brominated isobutylene‐co‐paramethylstyrene and its blends with EPDM

Bond graph multi-physics modeling of encapsulating materials in power electronic modules

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Product

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Thermophysical and mechanical properties of TiO₂ and silica nanoparticle-filled natural rubber composites

Thermophysical and mechanical properties of TiO₂ and silica nanoparticle-filled natural rubber composites