Thermal conductivity improvement of copper–carbon fiber composite by addition of an insulator: calcium hydroxide

Couillaud, Samuel; Lu, Yongfeng; Silvain, Jean François

doi:10.1007/s10853-014-8246-8

Cited by 3 publications

(3 citation statements)

References 19 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Due to the fact that CF has anisotropic thermal conductivity (TC) properties (TC parallel to the axis fiber equals to 540 W/m.K and TC perpendicular equals to 10 W/m.K), the resulting hot pressed MMC shows anisotropic macroscopic thermal conductivity. TC of hot pressed Cu/40CF in a plane perpendicular to the pressure direction is much higher than TC measured in a plane parallel to the pressure direction [36][37][38][39][40][41][42]. This is what was obtained for the HP1 sample, as shown in Table 3: TC  = 260 W/mK while TC// = 180 W/mK.…”

Section: Comparison Of Hot Pressed and Hydrothermal Sintered Cu/40cf supporting

confidence: 50%

Ultra-low temperature fabrication of copper carbon fibre composites by hydrothermal sintering for heat sinks with enhanced thermal efficiency

Prakasam

Morvan

Azina

et al. 2020

Composites Part A: Applied Science and Manufacturing

View full text Add to dashboard Cite

Highlights:  Dense Cu/40CF composite are fabricated by low temperature hydrothermal sintering at 265 °C and 250 MPa with 5 wt.% water.  Thermal properties of Cu/40CF composite materials fabricated by low temperature hydrothermal sintering are isotropic 2  Hydrothermal sintering increases thermal conductivity and reduces coefficient of thermal expansion in comparison to uniaxial hot pressing  Hydrothermal sintering improves mechanical hardness of Cu/40CF composite materials in comparison to uniaxial hot pressing

show abstract

Section: Comparison Of Hot Pressed and Hydrothermal Sintered Cu/40cf supporting

confidence: 50%

Ultra-low temperature fabrication of copper carbon fibre composites by hydrothermal sintering for heat sinks with enhanced thermal efficiency

Prakasam

Morvan

Azina

et al. 2020

Composites Part A: Applied Science and Manufacturing

View full text Add to dashboard Cite

show abstract

“…Cu-Ca/CF. Calcium (Ca) can also be added to Cu/ CF (30 vol.%) composites to modify their thermal properties [59]. In fact, because Ca is not stable under air (i.e.…”

Section: Chemical Interface (Or Interphase) Between Matrix and Reinfo...mentioning

confidence: 99%

A review of processing of Cu/C base plate composites for interfacial control and improved properties

Silvain¹,

Heintz²,

Veillère³

et al. 2020

Int. J. Extrem. Manuf.

View full text Add to dashboard Cite

The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials with a high thermal conductivity and thermal expansion coefficient compatible with chip materials while still ensuring the reliability of the power modules. Metal matrix composites, especially copper matrix composites, containing carbon fibers, carbon nanofibers, or diamond are considered very promising as the next generation of thermal-management materials in power electronic packages. These composites exhibit enhanced thermal properties, as compared to pure copper, combined with lower density. This paper presents powder metallurgy and hot uniaxial pressing fabrication techniques for copper/carbon composite materials which promise to be efficient heat-dissipation materials for power electronic modules. Thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermal and thermomechanical properties. Control of interfaces (through a novel reinforcement surface treatment, the addition of a carbide-forming element inside the copper powders, and processing methods), when selected carefully and processed properly, will form the right chemical/mechanical bonding between copper and carbon, enhancing all of the desired thermal and thermomechanical properties while minimizing the deleterious effects. This paper outlines a variety of methods and interfacial materials that achieve these goals.

show abstract

“…In addition, composites of metals having high thermal conductivity, such as copper or aluminum and carbon materials, are used for heat-radiation materials. For example, diamond, [2][3][4][5] graphite, [6][7][8] and carbon fiber [9][10][11][12][13] are being used as the carbon material. Because of low wettability between the carbon and metal base materials, some studies take the approach that interfacial strength is maintained by coating the carbon material and adding a binder.…”

Section: Introductionmentioning

confidence: 99%

Mechanism of Thermal Stress Relaxation of Non-bonded Al/Graphite laminated Roll Composite

Yamada

Matsuhata

Hohjo

et al. 2019

Journal of Elec Materi

View full text Add to dashboard Cite

Miniaturization and high-density packaging of power modules for use in vehicles increases the amount of heat they generate. To prevent damage from heat in such packages, we designed, optimized, and fabricated a composite roll laminated with a non-bonded graphite sheet and Al foil. To find the optimal design of this material, we used finite element analysis to model a non-bonded Al/graphite laminated roll composite, using this simulation to assess how the geometry of its constituent materials influenced its thermal stress. Based on this work, we found that the larger the aspect ratio of the Al foil, the greater the deformability of the composite and the higher its stress relaxation effect. In addition, we found that sandwiching the graphite sheet between the Al foil deforms the foil into a convex shape, and that the Al/graphite laminate composite shows higher thermal stress relaxation than the Al foil does on its own.

show abstract

Thermal conductivity improvement of copper–carbon fiber composite by addition of an insulator: calcium hydroxide

Cited by 3 publications

References 19 publications

Ultra-low temperature fabrication of copper carbon fibre composites by hydrothermal sintering for heat sinks with enhanced thermal efficiency

Ultra-low temperature fabrication of copper carbon fibre composites by hydrothermal sintering for heat sinks with enhanced thermal efficiency

A review of processing of Cu/C base plate composites for interfacial control and improved properties

Mechanism of Thermal Stress Relaxation of Non-bonded Al/Graphite laminated Roll Composite

Contact Info

Product

Resources

About