Thermal conductivity of a polyethylene filled with disoriented short‐cut carbon fibers

Agari, Yasuyuki; Ueda, Atsushi; Nagai, Susumu

doi:10.1002/app.1991.070430612

Cited by 133 publications

(83 citation statements)

References 11 publications

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“…Agari [89,90] introduced the vertical and parallel conduction mechanism, and the correlative model is more suitable to the polymeric composites filled with high-volume fraction of the thermally conductive fillers. It may effectively solve the shortcomings of other thermally conductive models.…”

Section: Y Agari Modelmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

302

124

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With the fast-developing miniaturization and integration of microelectronics packaging materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model and equations, mechanisms, commonly used thermally conductive fillers, and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.

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Section: Y Agari Modelmentioning

confidence: 99%

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Yang

Liang

et al. 2018

Adv Compos Hybrid Mater

302

124

View full text Add to dashboard Cite

show abstract

“…Table 2. Material parameters used in the calculations according to Equations (1)(2)(3)(4)(5)(6)(7)(8)(9)(10). K r in is the intrinsic thermal conductivity while h is the interfacial thermal conductance.…”

Section: Discussionmentioning

confidence: 99%

“…These materials, owing to the randomization of the anisotropic properties of their second phases, have relatively poor properties. In fact, the main problem posed by the various carbon reinforcements evaluated in the last twenty years (graphite particles, short carbon fibres or carbon nanotubes) seems to be the difficulty in getting massive orientation to take benefit of the exceptional planar (two-dimensional) properties of graphite [6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Anisotropy in thermal conductivity of graphite flakes–SiCp/matrix composites: Implications in heat sinking design for thermal management applications

Molina

Louis

2015

Materials Characterization

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Within the frame of heat dissipation for electronics, a very interesting family of anisotropic composite materials, fabricated by liquid infiltration of a matrix into preforms of oriented graphite flakes and SiC particles, has been recently proposed. Aiming to investigate the implications of the inherent anisotropy of these composites on their thermal conductivity, and hence on their potential applications, materials with matrices of Al-12wt.%Si alloy and epoxy polymer have been fabricated. Samples have been cut at a variable angle with respect to the flakes plane and thermal conductivity has been measured by means of two standard techniques, namely, steady state technique and laser flash method. Experimental results are presented and discussed in terms of current models, from which important technological implications for heat sinking design can be derived.

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“…[15] thermal resistance -based bounds for the effective conductivity of composites were determined. Also, Agari and Uno [16,17] proposed a practical and useful formula to calculate thermal conductivity of particulate composites whilst Khan and Muliana [18] proposed a microstructural model to evaluate thermal conductivity and thermal expansion coefficient for particulate composites, taking into account the particle interaction,. Also, in Ref.…”

Section: Introductionmentioning

confidence: 99%

The Thermal Conductivity of Periodic partIculate Composites as Obtained from a Crystallographic Mode of Particle Packing

Venetis¹,

Sideridis²

2018

Preprint

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In this paper, an icosahedral non -body centered model to simulate the periodic structure of homogeneous particulate composites, by predicting the particle arrangement, is presented. This model has yielded three different variations which correspond at three different deterministic particle configurations. In addition, the concept of boundary interphase between matrix and inclusions was taken into account. Thus, the influence of particle vicinity was examined in parallel with the interphase concept on the thermomechanical properties of the overall material. Next, by the use of this model the authors derived a closed -form expression to estimate the thermal conductivity of this type of composites. To test the validity of the model, the theoretical values arising from the proposed formula were compared with other theoretical predictions obtained from several accurate formulae found in the literature and an adequate accordance was observed.

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Thermal conductivity of a polyethylene filled with disoriented short‐cut carbon fibers

Cited by 133 publications

References 11 publications

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

Anisotropy in thermal conductivity of graphite flakes–SiCp/matrix composites: Implications in heat sinking design for thermal management applications

The Thermal Conductivity of Periodic partIculate Composites as Obtained from a Crystallographic Mode of Particle Packing

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