Thermal conductivity of aluminum, copper, iron, and tungsten for temperatures from 1 K to the melting point

Abstract

Literature data on the thermal conductivity of commercially Dure aluminum, copper, iron, and tunqsten specimens have been collected, coded, critically analyzed, and correlated with analytical techniques based on theoretical and empirical equations. The resulting functions are presented and used to qenerate tables and graphs of thermal conductivity as a function of temperature and residual resistivity ratio (RRR). An annotated biblioqraphy of references is included. Discussions are included on the variations in thermal conductivity caused by chemical impurities, physical defects, size effects, and maqnetic fields. Smoothed values are presented for temperatures from 1 K to near the melting point and for a large ranqe of RRR val ues.

Thermal conductivity measurements of impregnated Nb3Sn coil samples in the temperature range of 3.5 K to 100 K

“…=2250 W/m K at T=25 K are in good agreement with stated values for RRR=100 data of copper [3]. The typical distance for the temperature sensors to the resin interface layer is 10 mm at each side copper support.…”

“…Thermal conductivity measurements of impregnated Nb 3 Sn coil samples in the temperature range of 3.5 K to 100 K 1. Tested sample geometries Samples for thermal conductivity are cut from one of the first 11T dipole model superconducting coils.…”

“…The samples are probing the thermal conduction along the azimuthal direction along the Rutherford cable stack with the impregnation layers in between or across the two layers of the coil in radial direction, figure 1. The Rutherford cable is composed of Nb 3 Sn filaments embedded in a copper matrix of 0.7 mm strand diameter. The Rutherford cable consists of 40 strands.…”

In-plane Thermal Diffusivity Measurement of Thin Samples Using a Transient Fin Model and Infrared Thermography

“…For more thermal-conductivity data as a function of temperature, see Refs. [7] and [8]. It was known that the aluminum sample was not pure, but its properties were assumed not to differ too much from the tabulated values of pure material.…”

Electrical Conductance of Bolted Copper Joints for Cryogenic Applications

“…Since its low temperature thermal conductivity is due to electron transport limited by impurity scattering, substantial work has been performed to obtain high conductivity copper, developing purification and annealing methods [5][6][7]. As a result, samples with a very large electronic mean free path are obtained, providing large values of the thermal conductivity at sub-Kelvin temperatures [8][9][10][11]. It is desirable to introduce joints in the cryogenic system at different places, either for convenience in the original mounting, or in order to be able to change samples, sample holders, experimental cells or nuclear stages in ultra-low temperature research.…”