1997
DOI: 10.1016/s0955-2219(97)00084-8
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Thermal conductivity of compacted AIN samples

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Cited by 10 publications
(17 citation statements)
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“…Manipulating all of these factors in the proper way can eliminate the major defects and, consequently, improve the thermal conductivity, the most important property of this material. [3][4][5] In fact, thermal conductivities of aluminium nitride often differ significantly from the theoretical value (320 W/mK) because several existing defects, such as pores and grain boundary segregations, as well as point defects within the AlN lattice, cause a considerable decrease of thermal conductivity.…”
Section: Introductionmentioning
confidence: 98%
See 1 more Smart Citation
“…Manipulating all of these factors in the proper way can eliminate the major defects and, consequently, improve the thermal conductivity, the most important property of this material. [3][4][5] In fact, thermal conductivities of aluminium nitride often differ significantly from the theoretical value (320 W/mK) because several existing defects, such as pores and grain boundary segregations, as well as point defects within the AlN lattice, cause a considerable decrease of thermal conductivity.…”
Section: Introductionmentioning
confidence: 98%
“…1,2 These properties are very important for applications as substrates for highly integrated microelectronic packaging and have motivated a large number of studies aiming at property optimization and establishing a better understanding of the relationships between processing, microstructural features, and final properties. [3][4][5] Because of the covalent bonds, AlN has a low diffusivity and requires a high temperature (1900-2000°C) for sintering. The use of sintering aids is the approach more extensively studied to enhance AlN densification at relatively lower temperatures.…”
Section: Introductionmentioning
confidence: 99%
“…In the last 10 years, AlN ceramics have been intensively studied for substrates applications due to the high thermal conductivity, non-toxicity and low dielectric constant among other properties. [1][2][3] The thermal conductivity was found to depend on several factors, namely intrinsic and extrinsic. The intrinsic Mass and strain misfits caused by the vacant aluminium site increase the scattering cross section of phonons, which decreases the phonon mean free path, thereby lowering the thermal conductivity.…”
Section: Introductionmentioning
confidence: 99%
“…[3][4][5][6][7][8][9][10][11][12][13][14][15][16][17] The viability of using aqueous media for processing AlN at industrial level is strongly dependent on the final properties, namely thermal conductivity and mechanical properties. The achievement of comparable properties using water to disperse the powders (AlN + sintering aids) and aqueous suspensions to consolidate green bodies by colloidal shaping techniques or to granulate powders for dry pressing, will have enormous benefits in terms of health, economical and environmental impacts.…”
Section: Introductionmentioning
confidence: 99%
“…In the last 10 years, AlN ceramics have been intensively studied for substrates applications due to the high thermal conductivity, non-toxicity and low dielectric constant among other properties (Collange et al, 1997;Enloe et al, 1991;Jackson et al, 1997;Raether et al, 2001). The thermal conductivity was found to depend on several factors, namely intrinsic and extrinsic.…”
Section: Influence Of De-waxing Atmosphere On the Aln Propertiesmentioning
confidence: 99%