Thermal conductivity of wood-derived graphite and copper–graphite composites produced via electrodeposition

Johnson, Matthew T.; Childers, Amanda; Ramírez‐Rico, J.; Wang, Hsin; Faber, K. T.

doi:10.1016/j.compositesa.2013.06.009

Cited by 21 publications

(20 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…In recent years, particular interest is attracted by graphitized biocarbon matrices produced also by nat ural wood carbonization only in the presence of tran sition metal catalysts [6][7][8]. Due to the retention of the natural porosity inherent to natural wood and high heat and electrical conductivity of graphite, the fabri cation of graphitized biocarbon matrices is of great practical interest.…”

Section: Introductionmentioning

confidence: 99%

Microstructure, elastic and inelastic properties of partially graphitized biomorphic carbons

et al. 2015

View full text Add to dashboard Cite

Abstract-The microstructural characteristics and amplitude dependences of the Young's modulus E and internal friction (logarithmic decrement δ) of biocarbon matrices prepared by beech wood carbonization at temperatures T carb = 850-1600°C in the presence of a nickel containing catalyst have been studied. Using X ray diffraction and electron microscopy, it has been shown that the use of a nickel catalyst during carbon ization results in a partial graphitization of biocarbons at T carb ≥ 1000°C: the graphite phase is formed as 50 to 100 nm globules at T carb = 1000°C and as 0.5 to 3.0 μm globules at T carb = 1600°C. It has been found that the measured dependences E(T carb ) and δ(T carb ) contain three characteristic ranges of variations in the Young's modulus and logarithmic decrement with a change in the carbonization temperature: E increases and δ decreases in the ranges T carb < 1000°C and T carb > 1300°C; in the range 1000 < T carb < 1300°C, E sharply decreases and δ increases. The observed behavior of E(T carb ) and δ(T carb ) for biocarbons carbonized in the presence of nickel correlates with the evolution of their microstructure. The largest values of E are obtained for samples with T carb = 1000 and 1600°C. However, the samples with T carb = 1600°C exhibit a higher suscep tibility to microplasticity due to the presence of a globular graphite phase that is significantly larger in size and total volume.

show abstract

Section: Introductionmentioning

confidence: 99%

Microstructure, elastic and inelastic properties of partially graphitized biomorphic carbons

et al. 2015

View full text Add to dashboard Cite

show abstract

“…This was reflected by a 72% increase in thermal conductivity of the optimized composite over the non-optimized composite with equivalent copper volume fractions. 9,21 Finally, Figures 8 and 9 highlight the additions to Akolkar and Landau's model included in the current work by depicting the depletion of the accelerator and copper ions in the channel. 19 Figure 8 demonstrates the need for a diffusion-limited term when describing the possible evolution of the accelerator species.…”

Section: Resultsmentioning

confidence: 99%

“…8,9 In these materials, wood is used as a porous precursor, which, after pyrolysis, results in a ceramic that retains the naturally-optimized cellular structure of the parent material. The wood species of the scaffold precursor determines the pore size, volume fraction, distribution, and connectivity, offering a wide range of possible materials and tailorable porous systems.…”

mentioning

confidence: 99%

Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition

Childers

Johnson

Ramírez‐Rico

et al. 2013

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

A multi-element, time-dependent model is used to examine additive-assisted copper electroplating in macro-channels. This model is an adaptation of the work of Akolkar and Landau [J. Electrochem. Soc., 156, D351 (2009)], used to describe plating in micro-vias for integrated circuits. Using their method for describing species movement in the channel, the model has been expanded to include transport and adsorption limitations of the inhibitor and accelerator, as well as the copper ions in solution. The model is used to investigate copper plating as an infiltration method across many size scales and aspect ratios. Biomorphic graphite scaffolds produced from wood are used as a representative system and the results of a two-additive bath are used to characterize the behavior of the additives and determine the effectiveness of the plating. The results indicate that at macro-scales, channel dimensions play an increasingly important role in dictating the behavior of additive-assisted plating. Because additive systems are designed to establish differential surface coverage within the channel, the success of which is determined by the additive's rates of diffusion and adsorption, certain size scale/aspect ratio combinations preclude such coverage. A guide for sample geometries that may be successfully infiltrated with a two-additive bath is provided. Electrodeposition is a common method of producing multicomponent material systems.1,2 This technique is useful in overcoming common melt-based composite processing constraints, such as high melting points, fragile scaffolds, non-wetting components, and significant coefficient of thermal expansion (CTE) mismatch. Unlike melt infiltration or reactive wetting, electrodeposition is a low-temperature, non-reactive process. While electroformed copper is employed in the fabrication of items such as musical instruments, reflectors, and heat exchangers, 1 the electronics sector is responsible for the majority of advancements in the field, especially in terms of use as an infiltration method. Electrodeposition is used for interconnect metallization in integrated circuits, where small channels in a silicon wafer, known as vias, are filled with high purity copper. IBM pioneered this technique in 1998 to replace aluminum vapor deposition.3,4 While the microvias used in current integrated circuit technology can reach several hundred microns in dimension, channel size is trending toward nanosized, closely packed channels. [5][6][7] In other functional composites, one might contend with larger length scales and aspect ratios compared to metal interconnects. With this as motivation, we explore the feasibility of using existing electroplating techniques for composite processing of non-interconnect systems through a multi-component, time-dependent model. Specifically, we investigate infiltration of a metal into highly porous ceramic scaffolds with macro-sized channels.As a macro-porous system for study, we examine biomorphic SiCand graphite-Cu composites produced by electrodeposition, which may ...

show abstract

“…CFms/copper composites were recently studied by Johnson et al [7], who examined the thermal conductivity of wood-derived graphite and copper-graphite composites produced via electrodeposition. The thermal conductivity of the biomorphic graphite/copper composite was 10 times greater than that of biomorphic graphite, with the graphite/copper composites exhibiting a thermal conductivity ranging from 20 to 21 W/mK [7]. Zhai et al [8] studied the effects of vacuum and ultrasonic co-assisted electroless copper plating on CFms and noted increased conductivity ranging from 700 to 1885.8 S/cm, and increased compressive strength ranging from 0.70 to 1.66 MPa with increasing copper content.…”

mentioning

confidence: 99%

mentioning

confidence: 99%

Cu nanoparticle-embedded carbon foams with improved compressive strength and thermal conductivity

Kim¹,

Kim²,

Park³

et al. 2016

Carbon letters

View full text Add to dashboard Cite

Carbon foams (CFms) exhibit excellent physical properties, including good thermal conductivity, low density, high porosity and specific surface area, good vibration damping and shock absorption properties, and low thermal expansion coefficients. These properties are attractive in various applications such as thermal and electrical transfer devices, electrochemical supercapacitors, catalyst supports, gas adsorbents, filtration systems, and electromagnetic shielding. However, compared to metals and polymers, CFms do not exhibit good mechanical or thermal properties because of their porous structure; these shortcomings have limited the application of CFms in various fields [1][2][3][4].Researchers have sought to improve the mechanical and thermal properties of CFms through the addition of carbon nanofibers, carbon nanotubes, graphite and metal plating [5,6]. CFms/copper composites were recently studied by Johnson et al. [7], who examined the thermal conductivity of wood-derived graphite and copper-graphite composites produced via electrodeposition. The thermal conductivity of the biomorphic graphite/copper composite was 10 times greater than that of biomorphic graphite, with the graphite/copper composites exhibiting a thermal conductivity ranging from 20 to 21 W/mK [7]. Zhai et al. [8] studied the effects of vacuum and ultrasonic co-assisted electroless copper plating on CFms and noted increased conductivity ranging from 700 to 1885.8 S/cm, and increased compressive strength ranging from 0.70 to 1.66 MPa with increasing copper content.Cu exhibits high thermal and electrical conductivities, in the range of 350-400 W/mK and 59.17-59.59 × 10 6 Ω -1 m -1 , respectively; and it can be adhesively bonded with carbon matrices such as carbon nanofoams, mesoporous carbon templates and nanotube/nanofiber assemblies through electrodeposition, electroless deposition, coating, and doping. Numerous researchers have reported that, when used as battery electrodes, metal-bonded carbon matrices exhibit high electrical capacity and increased oxidative stability compared to nontreated graphite foams [5,[9][10][11][12][13][14][15]. However, preparing CFms with copper presents various problems. The coating of metal to the inner surfaces of porous materials that have small and deep pores using electrodeposition, metal layer joining, and electroless plating methods is difficult. Methods such as vacuum and ultrasonic mechanical processes are needed in addition, to uniformly coat metals onto the inner surfaces of CFms [16][17][18][19][20]. Alternatively, CFms have been uniformly embedded with copper via CuSO 4 solutions without the use of any mechanical process [21].In this study, we investigate economical and convenient methods of preparing coppernanoparticle-embedded CFms (Cu-CFms) using CuSO 4 solutions with different concentrations. The thermal and mechanical properties of the resulting Cu-CFms were investigated along with changes in the density and nanoparticulate size of the Cu.Isotropic pitch (IP) (pyrolyzed fuel oil; GS Caltex, Seoul...

show abstract

Thermal conductivity of wood-derived graphite and copper–graphite composites produced via electrodeposition

Cited by 21 publications

References 22 publications

Microstructure, elastic and inelastic properties of partially graphitized biomorphic carbons

Microstructure, elastic and inelastic properties of partially graphitized biomorphic carbons

Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition

Cu nanoparticle-embedded carbon foams with improved compressive strength and thermal conductivity

Contact Info

Product

Resources

About