Matter and Methods at Low Temperatures 2007
DOI: 10.1007/978-3-540-46360-3_4
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Thermal Contact and Thermal Isolation

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“…In order to meet these requirements, the carrier consisted of a copper core 0.125 inches thick with a thin layer of Kapton and then a single wiring layer of gold-plated copper. In order to make the persistent current connections superconducting, the connections were covered with Pb/Sn solder which has a Tc of 7 K [92]. In addition, it is desirable to have a superconducting ground plane below the MMC and SQUID.…”
Section: Chip Carrier and Platformmentioning
confidence: 99%
“…In order to meet these requirements, the carrier consisted of a copper core 0.125 inches thick with a thin layer of Kapton and then a single wiring layer of gold-plated copper. In order to make the persistent current connections superconducting, the connections were covered with Pb/Sn solder which has a Tc of 7 K [92]. In addition, it is desirable to have a superconducting ground plane below the MMC and SQUID.…”
Section: Chip Carrier and Platformmentioning
confidence: 99%