Thermal control of temperature-sensitive electronic components using a vapor chamber integrated with a straight fins heat sink: An experimental investigation

Rezk, Khaled; Abdelrahman, M.A.; Attia, Ahmed A.A.; Emam, Mohamed

doi:10.1016/j.applthermaleng.2022.119147

Cited by 28 publications

(5 citation statements)

References 30 publications

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“…In particular, the outer dimensions of UTVCs can be adjusted according to actual heat dissipation demands; simultaneously, they have advantages such as excellent thermal conductivity, large heat transfer area, and good temperature uniformity performance [19]. Scholars have conducted extensive research on the design, manufacturing, and performance of UTVCs [20][21][22]. Huang et al [23] adopted four SWMs and a copper mesh as the wick to create a gas-liquid coplanar UTVC with a thickness of 0.5 mm, and the ultimate power of the UTVC was 7.58 W when placed horizontally.…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation on Ultra-Thin Vapor Chamber with Composite Wick for Electronics Thermal Management

Zhang,

Huang,

Bai

et al. 2024

Micromachines

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Ultra-thin vapor chambers (UTVCs) are widely used to cool high-power electronics due to their excellent thermal conductivity. In this study, a UTVC of 82 mm × 58 mm × 0.39 mm with composite wick was prepared. The composite wick is composed of two layers of copper mesh and multiple spiral-woven meshes (SWMs), and the composite wick was applied in UTVC to improve liquid replenishment performance and temperature uniformity. Furthermore, the thermal performance of UTVCs with different support column diameters, filling ratios (FRs), and SWM structures was experimentally studied. The results found that the equivalent thermal conductivity (ETC) decreases as the diameter of the support column increases; the UTVC with 0.5 mm support column diameter has the highest ETC, at 3473 W/(m·K). Then, the effect of FR on the heat transfer performance of UTVCs with SWM numbers of 0, 1, 2, and 3 (0 SWMs, 1 SWM, 2 SWMs, 3 SWMs) is consistent, the 30% FR UTVC with 3 SWMs having the highest ETC, at 3837 W/(m·K). Finally, the increased number of SWMs can significantly improve the ultimate power of the UTVCs, the UTVC with 3 SWMs having the highest ultimate power, at 26 W. The above experimental studies indicate that the designed and manufactured UTVCs have great potential advantages in thermal dissipation for electronics.

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Section: Introductionmentioning

confidence: 99%

Experimental Investigation on Ultra-Thin Vapor Chamber with Composite Wick for Electronics Thermal Management

Zhang,

Huang,

Bai

et al. 2024

Micromachines

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“…Under the conditions of natural air cooling and vertical placement, the heat dissipation module can effectively manage 150 W of input power with the junction temperature close to 80 • C, which is about 20 • C lower than with a traditional aluminum-based fin heat dissipation module of the same size. Rezk et al [17] designed an integrated vapor chamber-straight fins (VCSF) heat sink using the bottom of the fin as the condensing end, and the results showed that VCSF's reduction of the temperature of electronic components under all operating conditions compares to that of SFs. Berut et al [18] manufactured and tested a vapor chamber with integrated hollow fins, determining a triangle as the optimal fin geometry to prevent liquid hold-up and flooding on the condensing end.…”

Section: Introductionmentioning

confidence: 99%

Experimental Study of Composite Heat Pipe Radiator in Thermal Management of Electronic Components

Wan,

Qian,

Zhu

et al. 2024

Energies

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Conventional straight fin (SF) radiators have difficulties meeting the cooling requirements of high-power electronic components. Therefore, based on the structure and technology of the detachable fin radiator, this paper proposes a kind of radiator embedded in the heat pipe base and uses the roll-bond flat heat pipe (RBFHP) to replace the traditional fin. The radiator has the advantages of modularity, easy manufacturing, low cost and good heat balance. In this study, the heat pipes (HPs)-RBFHPs radiator was tested in natural convection and forced convection to mimic the actual application scenario and compared with the conventional aluminum radiator. Heating power, angle, wind speed and other aspects were studied. The results showed that the cooling performance of the HPs-RBFHPs radiator was improved by 10.7% to 55% compared with that of the SF radiator under different working conditions. The minimum total thermal resistance in the horizontal state was only 0.37 °C/W. The temperature equalization of the base played a dominant role in the performance of the radiator at a large angle, and the fin group could be ineffective when the angle was greater than 60°. Under the most economical conditions with an inclination of 0° and a wind speed of 2 m/s, the input power was 340 W, the heat source temperature of the HPs-RBFHPs was only 64.2 °C, and the heat dissipation performance was 55.4% higher than that of SFs.

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“…Most high-precision electronic devices are extremely sensitive to temperature fluctuations, and therefore have high requirements for stable operating temperatures. [1,2] 2) The hazard of high-frequency electromagnetic waves is inevitably generated during the operation of electronics. Such generated electromagnetic waves not only possess a negative repercussion on the adjacent electronic systems, but also have nonnegligible concern for human health.…”

Section: Introductionmentioning

confidence: 99%

Cuttlefish‐Inspired Self‐Adaptive Liquid Metal Network Enabling Electromagnetic Interference Shielding and Thermal Management

Xing

Chen

et al. 2023

Adv Materials Technologies

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With the refinement and miniaturization of integrated electronic devices, the requirements for stable operating temperature and antielectromagnetic interference are increasingly high. However, most of the current materials necessitate to develop the intelligent self‐adaptive regulation in response to external field stimuli to gratify the stipulations of different operating environments. Herein, cuttlefish‐inspired smart liquid metal based‐liquid crystal elastomer (LGN‐LCE) dual‐functional material enabling self‐adaptive electromagnetic wave interference shielding and thermal management is presented. Liquid crystal elastomer matrix endows the LGN‐LCE dynamic self‐morphing properties under thermal activation, which leads to the liquid metal network with tunable thermal/electrical conduction. The thermal conductivity of LGN‐LCE can be increased to 10.3 W m−1 K−1 with the rise of surrounding temperature, while the electrical conductivity of LGN‐LCE can be enhanced to 4.3 × 105 S m−1. Such promoted electrical conductivity helps strengthen electromagnetic interference (EMI) shielding performance of LGN‐LCE, and the minimum EMI shielding effectiveness of LGN‐LCE can be improved from 48 to 62 dB within the X‐band. This work may not only pave a new way to rationally design a self‐adaptive EMI shielding and thermal management systems, but also show good prospects for practical applications, including thermal management materials, EMI materials, flexible electronic materials, smart materials, artificial intelligence systems, biomedical, and aerospace applications.

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Thermal control of temperature-sensitive electronic components using a vapor chamber integrated with a straight fins heat sink: An experimental investigation

Cited by 28 publications

References 30 publications

Experimental Investigation on Ultra-Thin Vapor Chamber with Composite Wick for Electronics Thermal Management

Experimental Investigation on Ultra-Thin Vapor Chamber with Composite Wick for Electronics Thermal Management

Experimental Study of Composite Heat Pipe Radiator in Thermal Management of Electronic Components

Cuttlefish‐Inspired Self‐Adaptive Liquid Metal Network Enabling Electromagnetic Interference Shielding and Thermal Management

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