1993
DOI: 10.1002/pola.1993.080310434
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Thermal crosslinking of polyimides and polysulfone using 3,3‐dimethyl‐1‐phenyltriazene compounds

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Cited by 10 publications
(3 citation statements)
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“…Ladder structures, commonly used for high thermal stability applications, must be avoided to obtain a sufficiently low T g . The route we have chosen is to combine the high thermal stability of polyaryletherketones (PAEKs) 26 with phenylethynyl‐based crosslink chemistry27–35 (Fig. 3).…”
Section: Resultsmentioning
confidence: 99%
“…Ladder structures, commonly used for high thermal stability applications, must be avoided to obtain a sufficiently low T g . The route we have chosen is to combine the high thermal stability of polyaryletherketones (PAEKs) 26 with phenylethynyl‐based crosslink chemistry27–35 (Fig. 3).…”
Section: Resultsmentioning
confidence: 99%
“…Ladder structures, commonly used for high thermal stability applications, must be avoided to obtain a sufficiently low T g . The route we have chosen is to combine the high thermal stability of polyaryletherketones (PAEKs) [26] with phenylethynyl-based crosslink chemistry [27][28][29][30][31][32][33][34][35] (Fig. 3).…”
Section: Resultsmentioning
confidence: 99%
“…PiNFAs possess a gel content of >96% and are nearly unchanged with increasing binder concentration, far exceeding previous studies using cross-linked PI reactions. 31,48,49 This observation indicates the presence of highly cross-linked networks in aerogels. Figure 3b illustrates the verification of the physical structure.…”
Section: Formation and Characterization Of Pinfasmentioning
confidence: 80%