Thermal crosstalk in 4 x 4 vertical-cavity surface-emitting laser arrays

Wipiejewski, T.; Young, D.B.; Thibeault, B.J.; Coldren, L.A.

doi:10.1109/68.508710

Cited by 33 publications

(11 citation statements)

References 12 publications

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“…DT off is the turn-off temperature increase. R th,jm , to which the thermal crosstalk conductivities between arbitrary ith and jth lasers add, is the effective thermal resistance [10]. n k is the kink voltage and i m , P opt,m , are current and output power of the mth laser, respectively.…”

Section: Characterization Of Devicesmentioning

confidence: 99%

High-power InGaAs VCSEL's single devices and 2-D arrays

Li¹,

Sun²,

Wang³

et al. 2007

Journal of Luminescence

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Section: Characterization Of Devicesmentioning

confidence: 99%

High-power InGaAs VCSEL's single devices and 2-D arrays

Li¹,

Sun²,

Wang³

et al. 2007

Journal of Luminescence

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“…7,8) Numerous studies were conducted on the thermal resistance of VCSELs bonded to ICs 9,10) and the thermal interference of 2-D VCSEL arrays. [11][12][13] For thinfilm VCSELs, substrate removal can cause higher thermal resistance because of the lower heat transfer efficiency of convection and radiation from the top surface to the air than that of conduction to the GaAs substrate. As a consequence, the structural design based on thermal analysis is important in order to improve laser performance.…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of Thin-Film Vertical-Cavity Surface-Emitting Lasers Using Finite Element Method

Ouchi

2002

Jpn. J. Appl. Phys.

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The thermal characteristics of thin-film vertical-cavity surface-emitting lasers (VCSELs) have been studied by means of finite element analysis. The thin-film VCSELs transferred onto a selected substrate, which we have already demonstrated, are very attractive for integrated optoelectronic devices. However, structural design based on thermal analysis is required to improve the performance especially for small aperture VCSELs. We confirmed that an AlN submount used as the transferred substrate was satisfactory from the viewpoint of thermal conductivity. We also numerically showed that an Au plating layer on the top surface and an oxide-defined layer would improve the thermal characteristics. Although the thermal resistance R th of 5 m airpost thin-film VCSEL is very high, the 5 m oxide-defined aperture with 35 m mesa and an Au plating layer of 3 m thickness can reduce R th by about 27%.

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“…where P is the power of the heat source, Plllr is the effective lateral thermal-conductivity, and r is the distance from the source [6,7]. Figure 2 compares the simulation result to experimentally measured surface temperatures.…”

Section: Vcsel Thermal Issuesmentioning

confidence: 87%