Thermal cycling reliability of lead‐free chip resistor solder joints

Suhling, Jeffrey C.; Gale, H. S.; Johnson, Richard W.; Islam, M.N.; Shete, T.; Lall, Pradeep; Bozack, Michael J.; Evans, John L.; Seto, Ping; Gupta, Tarun Kumar; Thompson, James R.

doi:10.1108/09540910410537354

Cited by 31 publications

(17 citation statements)

References 7 publications

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“…This result implies that the reliability of SnAgCu alloys outperform SnPb for small components and vice versa for large components. This conclusion is consistent with the thermal fatigue experimental results that suggested that SnAgCu alloys outperform SnPb at low strain applications and vice versa at high-strain amplitude applications [14][15][16][17][18][19]. Figure 10.…”

Section: Effect Of Thermal Shocksupporting

confidence: 81%

Investigation of the Lead-free Solder Joint Shear Performance

Webster

Pan

Toleno

2007

Journal of Microelectronics and Electronic Packaging

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Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resistors (1206, 0805, 0603 and 0402). Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb were developed with three levels of peak temperature (12ºC, 22ºC, and 32ºC above solder liquidus temperature, or 230ºC, 240ºC, and 250ºC for SAC 305; and 195ºC, 205ºC, and 215ºC for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). Half of the test vehicles were then subjected to air-to-air thermal shock conditioning from -40 to 125°C. The shear force data were analyzed using the Analysis of Variance (ANOVA). The fracture surfaces were studied using a Scanning Electron Microscopy (SEM) with Energy Dispersive Spectroscopy (EDS). It was found that thermal shock degraded both SnPb and SnAgCu joints shear strength, and that the effect of thermal shock on solder joint shear strength is much more significant than that of reflow profile. The SnAgCu solder joints have weaker shear strength than the SnPb solders. SnAgCu solder joint after thermal shock retains more of its shear strength than that of SnPb for small components and vice versa for larger components.

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Section: Effect Of Thermal Shocksupporting

confidence: 81%

Investigation of the Lead-free Solder Joint Shear Performance

Webster

Pan

Toleno

2007

Journal of Microelectronics and Electronic Packaging

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“…23 It must be noted, however, that the size and distribution of the IMC particles in the initial microstructure of the Sn-8In-3Ag-0.5Cu joints in Ref. 23 did not correspond with the as-soldered microstructure of the SAC-In joints. This suggested that the Ag content has a major effect on the solidified microstructure and its recrystallization and subsequent coarsening during the TCT in In-containing lead-free solders, similarly to in hypoeutectic, eutectic, and hypereutectic ternary Sn-Ag-Cu alloys.…”

Section: Metallurgy Of Sac-in Jointsmentioning

confidence: 88%

“…Suhling et al 23 observed that Sn-8In-3Ag-0.5Cu joints (2512 resistor) revealed also a coarsening of the IMC particles during the TCT, although no quantitative analysis of the composition of the IMC particles and the Sn matrix was given. 23 It must be noted, however, that the size and distribution of the IMC particles in the initial microstructure of the Sn-8In-3Ag-0.5Cu joints in Ref. 23 did not correspond with the as-soldered microstructure of the SAC-In joints.…”

Section: Metallurgy Of Sac-in Jointsmentioning

confidence: 97%

“…[13][14][15][16][17][18][19][20][21][22] Moreover, the enhanced reliability of indiumcontaining Sn-based solder joints compared with ternary near-eutectic Sn-Ag-Cu solder joints in thermal cycling tests over temperature ranges of À40°C to 125°C and À40°C to 150°C was reported earlier. 22,23 Thus, the In-containing Sn-7In-4.1Ag-0.5Cu solder alloy was selected for this study in order to investigate the effect of the alloy composition on the thermal fatigue endurance and lifetime duration of the test joints in extremely severe test conditions over a temperature range of À55°C to 150°C. In addition, a reference test set consisting of LTCC modules with Sn-4Ag-0.5Cu/PCSB composite joints was fabricated and tested.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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The thermal fatigue endurance of two lead-free solder/plastic-core solder ball (PCSB) composite joint structures in low-temperature co-fired ceramic (LTCC) modules was investigated using a thermal cycling test over a temperature range of À55°C to 150°C. The investigated solder alloys were Sn-7In-4.1Ag-0.5Cu (SAC-In) and 95.5Sn-4Ag-0.5Cu (SAC). Three failure mechanisms were observed in the test joints. Transgranular (fatigue) cracking mixed with minor intergranular cracking was the dominant failure mechanism at the outer edge of the joints in both test assemblies, whereas separation of the solder/intermetallic compound (IMC) interface and creep cracking occurred in the other parts of the test joints. The propagation rate of the transgranular crack was lower in the SAC-In joints compared with in the SAC joints. Furthermore, the SAC solder seemed to be more prone to separation of the solder/IMC interface, and more severe intergranular (creep) cracking occurred in it compared with in the SAC-In solder. In the thermal cycling test conditions, the better thermal fatigue endurance of the SAC-In solder composite joints resulted in a 75% higher characteristic lifetime compared with the SAC composite joints.

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“…9,[14][15][16] In addition to the solder strength and IMC thickness, some other factors such as the geometry of the joint, working temperature, microstructural evolution, roughness of the interface, and the amount of voids can affect the extent of the failure mode. 5,15,[17][18][19] The mechanics of the interfacial failure of solder joints were considered in several studies. 14,[20][21][22][23][24][25][26][27] Hayes et al 14 experimentally estimated the mode I fracture toughness of solder joints by performing high-strain-rate fracture tests on modified compact tension specimens.…”

Section: Introductionmentioning

confidence: 99%

On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

Maleki

Botsis

2011

Journal of Elec Materi

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The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformation of bulk solder on the interfacial failure of lead-free solder joints. For this purpose, interfacial damage evolution and mode I fracture behavior of the joint were evaluated experimentally by performing stable fracture tests at different strain rates employing an optimized tapered double cantilever beam (TDCB) design. The viscoplastic behavior of the solder was characterized in shear, and the constitutive parameters related to the Anand model were determined. A rate-independent cohesive zone damage model was identified to best simulate the interfacial damage progression in the TDCB tests by developing a three-dimensional (3D) finite-element (FE) model and considering the viscoplastic response of the bulk solder. The influence of strain rate on the load capability and failure mode of the joint was clarified by analyzing the experimental and simulation results. It was shown how, at the lower strain rates, the normal stress generated at the interface is limited by the significant creep relaxation developed in the bulk solder and thus is not sufficiently high to initiate interfacial damage, whereas at higher rates, a large amount of the external energy is dissipated into interfacial damage development.

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Thermal cycling reliability of lead‐free chip resistor solder joints

Cited by 31 publications

References 7 publications

Investigation of the Lead-free Solder Joint Shear Performance

Investigation of the Lead-free Solder Joint Shear Performance

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

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