2012
DOI: 10.6023/a12070451
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Thermal Decomposition of Epoxy Resin Contained in Printed Circuit Boards from Reactive Dynamics Using the ReaxFF Reactive Force Field

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Cited by 11 publications
(5 citation statements)
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“…As studied by Diao et al, 27 during pyrolysis of epoxy resin, the main mechanisms to form H 2 O and H 2 are hydroxyl free radical capture of hydrogen from other radicals and intermolecular dehydrogenation reactions, respectively. Thus, combined with discussions of Fig.…”
Section: Investigation Of Inuence On Reaction Rates Under Microwave ...mentioning
confidence: 99%
See 1 more Smart Citation
“…As studied by Diao et al, 27 during pyrolysis of epoxy resin, the main mechanisms to form H 2 O and H 2 are hydroxyl free radical capture of hydrogen from other radicals and intermolecular dehydrogenation reactions, respectively. Thus, combined with discussions of Fig.…”
Section: Investigation Of Inuence On Reaction Rates Under Microwave ...mentioning
confidence: 99%
“…This causes the numbers of C 1 -C 5 compounds to rocket. Based on research by Diao et al, 27 partial small free radicals obtained during the early stage of epoxy resin decomposition combine into graphene. Acharya et al 28 reported that fullerene fragments were detected during the decomposition of polycyclic aromatic compounds.…”
Section: Analyses Of Temperature-rising Characteristicsmentioning
confidence: 99%
“…Reactive force field (ReaxFF) has been used to simulate the thermal decomposition process of noncrosslinked EP copolymers and analyze the chemical reaction path for small molecule products at various temperatures [ 19 , 20 ]. Previous studies have successfully employed reactive molecular dynamics (MD) simulations on reaction rates, species products, and initiation time of polymer decomposition and organic compound combustion at high-pressure and -temperature conditions with an extremely strong electrostatic field that cannot be characterized by high-voltage experiments such as dielectric breakdown and partial discharge for polymeric insulation materials [ 21 , 22 , 23 ].…”
Section: Introductionmentioning
confidence: 99%
“…However, it is difficult to reveal the aging micro-mechanism and degradation cracking process of insulation materials under partial discharge (PD) by experimental research, physical modeling and other methods. Furthermore, the research on simulation analysis at atomic level is mostly limited to the thermal decomposition process of macromolecule materials [15,16]. Few studies have been conducted on the influence mechanism of high-energy particle impact on aging and cracking of epoxy resin materials at atomic level.…”
Section: Introductionmentioning
confidence: 99%