Thermal degradation and endurance of polyimide films

BPDA-PDA Polyimide: Synthesis, Characterizations, Aging and Semiconductor Device Passivation

“…Moreover, if the diamine ODA is replaced by PDA in BPDA-based PIs, Td increases of 68 °C in nitrogen and 105 °C in air. Indeed, this is due to the lower thermal stability of the ether bonds inducing earlier degradations than the rest of the structure [1,44]. Figure 8 shows the evolution of the FTIR spectrum of BPDA-PDA before and after an aging at 300 °C in nitrogen during 1000 h and the evolution of the film thickness and the related breakdown field during this aging.…”

“…It was found that while thermal degradation occurred throughout the material, the oxidative degradation occurs mainly within a thin surface layer where oxygen diffuses into the material. Few papers discussed the effect of thermal aging on the electrical properties of PIs and this is always for thick and freestanding films [44,45]. Consequently, an overall understanding of the thermo-oxidative aging mechanisms (for PI thickness <20 µm) and their effects on the electrical properties are still lacking.…”

“…The poly(4-4'-oxydiphenylene biphenyltetracarboximide) (BPDA-ODA), the poly(4-4'-oxydiphenylene benzophenonetetracarboximide) (BTDA-ODA), the poly(p-phenylene benzophenonetetracarboximide) (BTDA-PDA) and the poly(p-phenylene oxydiphthalimide) (ODPA-PDA) have a chemical packing which leads to similar issues on Si wafer due to large CTEs mismatching (28 ppm/°C). Moreover, PMDA-ODA, BPDA-ODA, BTDA-ODA and ODPA-PDA exhibit the lowest degradation temperature values due to the degradation of the C-O-C ether bond present in the PI monomer unit [1,15,16]. Tg: glass transition temperature; Td: degradation temperature defined at 10% wt.…”

Dielectrics for High Temperature SiC Device Insulation: Review of New Polymeric and Ceramic Materials

“…three in the elementary monomer backbone), the absence of the C-O-C ether group in the case of BPDA/PDA PI allows increasing T d of 60 °C in nitrogen and 110 °C in air in comparison to T d of PMDA/ODA PI (see Figure 2). Indeed, this is due to the lower thermal stability of the ether bonds inducing earlier degradations than the rest of the structure (Sroog, 1965;Tsukiji, 1990). Although the degradation temperature obtained by DTGA appears as an important parameter for the evaluation of the thermal stability, it is not sufficient to valid that a polymer can endure high temperature during a very long time.…”

Improvement of Polyimide Electrical Properties During Short-Term of Thermal Aging

“…However, although electrical and dielectric properties of PI are already known [2,3], little is known on their evolution during thermal aging up to now [4]. In this paper, the electrical properties of a biphenyltetracarboxilic dianhydride acid p-phenylene diamine (BPDA/PPD) PI (cf.…”