2021
DOI: 10.1109/tcpmt.2021.3105003
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Thermal Design, Optimization, and Packaging of Planar Magnetic Components

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Cited by 17 publications
(7 citation statements)
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“…This method enables the computation of a detailed temperature distributions. Many authors have used the FEM to study the thermal performance of planar magnetics [65] - [80].…”
Section: ) Finite Element Modelingmentioning
confidence: 99%
See 1 more Smart Citation
“…This method enables the computation of a detailed temperature distributions. Many authors have used the FEM to study the thermal performance of planar magnetics [65] - [80].…”
Section: ) Finite Element Modelingmentioning
confidence: 99%
“…A set of ten planar magnetics designed for a 125 kW automotive boost converter was studied in [80]. This study focuses on the packaging and thermal management of magnetic components.…”
Section: ) Finite Element Modelingmentioning
confidence: 99%
“…The electrical parameters of the equivalent electrical circuit are calculated as follows [16][17][18]; (17) tgap is the spacing between primary and secondary coils, relative permittivity of Si3N4 equals to 6.…”
Section: Primary and Secondary Turn's Number Np Nsmentioning
confidence: 99%
“…[17] presented a dimensioning and thermal modelling of a multilayer capacitor at low temperature cofired ceramic intended to be inserted in a low voltage converter. [18] performed a detailed study for designing an integrated structure with a dual-layer microtransformer model associated with two layers of magnetic cores. Their research focused the impact of thickness of a planar coil on the inductance value.…”
mentioning
confidence: 99%
“…The planar topology seamlessly incorporates an air gap in the path of magnetic flux, the air gap causing reluctance to magnetic flux in the core, thereby increasing saturation current and reducing core losses. In the past, the dual-core planar inductors have mainly been demonstrated and studied at the board level [10] [11]. There are only a few dual-core spiral power inductors embedded in the package [12] or interposer [13].…”
Section: Introductionmentioning
confidence: 99%