Thermal Desorption Spectroscopic Study of Hydrogen in Electrodeposited Ni-P Films

Takemoto, Tatsuya; Fukumuro, Naoki; Yae, Shinji; Matsuda, Hitoshi

doi:10.1149/1.3557566

Cited by 10 publications

(2 citation statements)

References 9 publications

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“…Therefore, one peak was assumed to be this peak. 20) The results of the GD-OES analysis shown in Fig. 5 are consistent with the results of the high-phosphorus-type plated specimen having a large amount of hydrogen in the film.…”

Section: Hydrogen Analysissupporting

confidence: 83%

Effect of Electroless Ni–P Plating on Rotary Bending Fatigue Strength of A2017-T4 Aluminum Alloy

et al. 2022

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In this study, A2017-T4 aluminum alloy was plated with electroless NiP with different phosphorus content and rotary bending fatigue test was conducted to investigate the effect of hydrogen by plating on fatigue properties. The fatigue strength of the low-phosphorus type NiP plated specimen was higher than that of the untreated specimen, while that of the high-phosphorus type plated specimen was much lower. It is clear that the fatigue strength differs greatly depending on the phosphorus content in the plating film. The decrease in fatigue strength of the high phosphorus type plating specimen was attributed to hydrogen induced by plating from hydrogen analysis. Thus, despite the previous report that 2000 series aluminum alloys do not exhibit hydrogen embrittlement in slow strain rate tensile tests under wet condition, it was found that A2017-T4 aluminum alloy undergo hydrogen embrittlement when the alloy is plated with high-phosphorus type electroless NiP and fatiguetested on rotary bending machine.

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Section: Hydrogen Analysissupporting

confidence: 83%

Effect of Electroless Ni–P Plating on Rotary Bending Fatigue Strength of A2017-T4 Aluminum Alloy

et al. 2022

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“…In the case of Ni foil heat-treated at high hydrogen pressure, not only the desorption peaks attributed to the break-up of Vac-H clusters at 631 K and 792 K, but also a pronounced peak attributed to the hydrogen desorption from the regular interstitial sites was observed at 380 K. 20,21 Furthermore, in the case of electrodeposited Ni films, only the desorption peaks attributed to the break-up of Vac-H clusters were observed after a long time, 20,21 while the desorption peak attributed to the desorption of interstitial hydrogen was observed 1 h after deposition. 25 These results may be due to the hydrogen solubility of Ni is higher than that of Cu. 21 In the case of electroless Cu deposition, according to the Reactions 1 ∼4, 4-6 since twice as many adsorbed hydrogen atoms as Cu atoms are generated, the hydrogen atoms may be incorporated into the interstitial sites in the Cu film.…”

Section: Resultsmentioning

confidence: 99%

Existing States of Co-Deposited Hydrogen in Electrolessly Deposited Copper Films from EDTA Complex Bath

Fukumuro¹,

Tohda²,

Yae³

2022

J. Electrochem. Soc.

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The existing states of co-deposited hydrogen in copper films electrolessly deposited from an ethylenediaminetetraacetatic acid complex bath were investigated using thermal desorption spectroscopy. Small desorption peaks at 500-700 K and large desorption peaks at 900-1300 K were observed in the as-deposited copper film, and these were attributed to the break-up of vacancy-hydrogen clusters and the desorption of molecular hydrogen from nanovoids, respectively. Moreover, an unknown desorption peak appeared at around 390 K. The total amount of desorbed hydrogen from the copper film in atomic ratio was 1.2 × 10-2, most of which was non-diffusible hydrogen desorbed above 800 K. A large number of nanovoids distributed in the grains were observed in the copper film. After 7 days, no significant change in hydrogen desorption above 500 K was observed, while the unknown desorption peak around 390 K disappeared. The as-deposited copper film showed lattice expansion and compressive residual stress, which were reduced after 7 days. Therefore, we attributed the unknown desorption peak appearing at around 390 K to the desorption of hydrogen atoms trapped by regular interstitial sites in the copper lattice.

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Plating

Watanabe¹

2020

Nano-Plating (II)

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Thermal Desorption Spectroscopic Study of Hydrogen in Electrodeposited Ni-P Films

Cited by 10 publications

References 9 publications

Effect of Electroless Ni–P Plating on Rotary Bending Fatigue Strength of A2017-T4 Aluminum Alloy

Effect of Electroless Ni–P Plating on Rotary Bending Fatigue Strength of A2017-T4 Aluminum Alloy

Existing States of Co-Deposited Hydrogen in Electrolessly Deposited Copper Films from EDTA Complex Bath

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