Thermal diffusivity measurement of thin films by means of an ac calorimetric method

Hatta, Ichiro; Sasuga, Y.; Kato, Ryo; Maesono, Akikazu

doi:10.1063/1.1138117

Cited by 213 publications

(92 citation statements)

References 3 publications

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“…A number of frequency dependent techniques, in which oscillating power is applied to the sample and resulting temperature oscillations measured, have been developed to measure thermal conductivity of small samples. [7][8][9][10][11][12][13][14][15] For these, the power transported out of the sample by leads and radiation determines the "external" thermal time constant,  1 , but measurements are typically made at frequencies  >>1/ 1 , 8 so that heat loss and radiation corrections are negligible.…”

Section: 3mentioning

confidence: 99%

“…One disadvantage of the 3 technique is that for a layered, anisotropic crystal the heater's oscillating temperature will be a function of the geometric mean of the "in-plane" and transverse thermal conductivities, 15 so the two components are not separately determined; in addition, it may be difficult to apply a low-noise Joule heater to some organic materials without damaging the material. Alternatively, other investigators have used chopped light to apply oscillating power to one surface of the sample and measured the oscillating temperature at different positions and/or frequencies; [6][7][8][9][10][12][13][14] the frequency dependent response is a function of the thermal diffusivity, D  /c, where c is the specific heat,  the mass density, and  the thermal conductivity. Most commonly, the oscillating temperature is measured on the opposite surface as a function of the lateral distance from the light, either by screening the light from part of the sample [8][9][10]14 or by using a laser to illuminate a small spot.…”

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confidence: 99%

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Interlayer thermal conductivity of rubrene measured by ac-calorimetry

Zhang

Brill

2013

Journal of Applied Physics

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We have measured the interlayer thermal conductivity of crystals of the organic semiconductor rubrene, using ac-calorimetry. Since ac-calorimetry is most commonly used for measurements of the heat capacity, we include a discussion of its extension for measurements of the transverse thermal conductivity of thin crystals of poor thermal conductors, including the limitations of the technique. For rubrene, we find that the interlayer thermal conductivity,  0.7 mW/cm·K, is several times smaller than the (previously measured) in-layer value, but its temperature dependence indicates that the interlayer mean free path is at least a few layers.2

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Section: 3mentioning

confidence: 99%

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confidence: 99%

Interlayer thermal conductivity of rubrene measured by ac-calorimetry

Zhang

Brill

2013

Journal of Applied Physics

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“…The so-called ac calorimetry technique can measure thermal diffusivity parallel to the broad surface in a thin material [13,14]. In the measurement system, a part of the thin material is shadowed by a mask on the surface, as shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

Construction of a Novel Method of Measuring Thermal Conductivity for Nanostructures

Ikeda¹,

Yoshida²,

Suzuki³

et al. 2015

MST

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With the aim of characterizing the thermal conduction in a nanometer-scaled materials, we have constructed a novel method on the basis of an ac calorimetric method. In this method, periodic sample heating is performed by light irradiation and the corresponding periodic temperature is detected by infrared irradiative thermometer. This makes us measure the thermal diffusivity out of contact with the objective sample. In the present study, we confirm to measure the thermal diffusivity of bulk Si and Cu by this non-contact method with halogen-lamp irradiation. In determining the thermal diffusivity from the relationship between distance deviation and delay time, the simplest wave equation is used, and the obtained values of thermal diffusivity for Si and Cu are close to those reported. Therefore, this non-contact method is useful for evaluating the thermal conduction and applicable for nanometer-scaled materials by improving local heating and local detecting systems. AbstrakPenyusunan Metode Baru untuk Mengukur Konduktivitas Termal untuk Strukturnano. Dengan tujuan untuk menggambarkan proses konduksi termal pada bahan-bahan berskala nanometer, kami telah menyusun sebuah metode baru yang didasarkan pada metode kalorimetrik ac. Di dalam metode ini, pemanasan sampel secara periodik dilaksanakan dengan iradiasi sinar, dan suhu periodik yang sejajar dideteksi dengan termometer iradiatif infra merah. Dengan demikian, kami mengukur difusivitas termal tanpa melibatkan kontak dengan sampel objektif. Di dalam kajian ini, kami memutuskan untuk mengukur difusivitas termal dari limbak Si dan Cu menggunakan metode tanpa kontak ini dengan iradiasi lampu halogen. Untuk menentukan difusivitas termal dari hubungan antara deviasi jarak dan waktu tunda, kami menggunakan persamaan gelombang yang paling sederhana, dan angka-angka difusivitas termal dari Si dan Cu yang diperoleh ternyata hampir sama dengan angka-angka yang telah dilaporkan. Oleh karena itu, metode tanpa kontak ini berguna untuk mengevaluasi konduksi termal dan dapat diterapkan untuk bahan-bahan berskala nanometer dengan memperbaiki pemanasan lokal dan sistem-sistem pendeteksian lokal.

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“…One of the early attempts in this direction was by Hatta et al [13], who measured thermal diffusivity of thin films by an ac calorimetric method. Measurements were reported in thin films of nickel, silicon, stainless steel, and aluminum with thickness in the range 50 to 300 µ m. However, the dependence of film thickness on thermal diffusivity was not reported in that work.…”

Section: Introductionmentioning

confidence: 99%

Thermal diffusion in thin plates and coatings: influence of thickness and substrate material

Soumya¹,

Philip²

2016

Turk J Phys

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Abstract:The dependence of thermal diffusivity/conductivity on thickness for a variety of coatings and free-standing thin metallic plates was measured using a traveling photothermal technique. The selected materials have large differences in terms of their thermal conductivity. Measurements were carried out on coatings prepared on substrates with two widely different values for thermal conductivity to bring out the influence of substrate thermal conductivity on the thermal diffusivity/conductivity of the coating. Thermal diffusivity/conductivity increases exponentially with coating thickness with the value saturating at a definite thickness. The variation follows an empirical relation, which can predict thermal diffusivity of a coating at any thickness in the low thickness regime. In the region where thermal diffusivity increases exponentially with thickness, thermal diffusivity of the coating is lower when the substrate is a better thermal conductor, implying that thermal waves diffuse into substrate causing an overall reduction in thermal diffusivity. However, beyond the saturation thickness the thermal diffusivity is independent of substrate material. Thermal conductivity of coatings as well as thin metallic plates follows analogous variations with thickness and substrate material. The results will help in providing a better theoretical description of heat transport in low dimensional structures.

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Thermal diffusivity measurement of thin films by means of an ac calorimetric method

Cited by 213 publications

References 3 publications

Interlayer thermal conductivity of rubrene measured by ac-calorimetry

Interlayer thermal conductivity of rubrene measured by ac-calorimetry

Construction of a Novel Method of Measuring Thermal Conductivity for Nanostructures

Thermal diffusion in thin plates and coatings: influence of thickness and substrate material

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