2018
DOI: 10.1016/j.ijheatmasstransfer.2018.03.039
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Thermal diode using controlled capillary in heterogeneous nanopores

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Cited by 13 publications
(4 citation statements)
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“…Inadvertent wetting of Plate 2 during reverse mode operation will facilitate latent heat transfer that will undermine the insulation performance and significantly diminish the diodicity. Thermal diodes are well suited to electronics cooling applications Chen, 2011 &Chen et al, 2012;Blet et al, 2017;Avanessian and Hwang, 2018;Traipattanakul et al, 2019;Wong et al, 2019), solar collector applications (De Beijer, 1998;Quinlan, 2010;Souliotis et al, 2011&2017;Smyth et al, 2015a&b, 2017Smyth et al, 2015a&b, , 2018Smyth et al, 2015a&b, , 2019Pugsley et al, 2016;Pugsley, 2017;Muhumuza et al, 2019a & b), climate control building envelopes (Chen et al, 1998;Varga, 2002;Reay et al, 2014;Villeneuve et al, 2017), and permafrost stabilisation applications (Pan and Wu, 2002;Pei et al, 2017). Applications in spacecraft (Gaddam and Huxtable, 2017) and caloric refrigeration systems (Hess et al, 2019), and thermal computing (Tso and Chao, 2016;Shen et al, 2018) have also been proposed.…”
Section: Introductionmentioning
confidence: 99%
“…Inadvertent wetting of Plate 2 during reverse mode operation will facilitate latent heat transfer that will undermine the insulation performance and significantly diminish the diodicity. Thermal diodes are well suited to electronics cooling applications Chen, 2011 &Chen et al, 2012;Blet et al, 2017;Avanessian and Hwang, 2018;Traipattanakul et al, 2019;Wong et al, 2019), solar collector applications (De Beijer, 1998;Quinlan, 2010;Souliotis et al, 2011&2017;Smyth et al, 2015a&b, 2017Smyth et al, 2015a&b, , 2018Smyth et al, 2015a&b, , 2019Pugsley et al, 2016;Pugsley, 2017;Muhumuza et al, 2019a & b), climate control building envelopes (Chen et al, 1998;Varga, 2002;Reay et al, 2014;Villeneuve et al, 2017), and permafrost stabilisation applications (Pan and Wu, 2002;Pei et al, 2017). Applications in spacecraft (Gaddam and Huxtable, 2017) and caloric refrigeration systems (Hess et al, 2019), and thermal computing (Tso and Chao, 2016;Shen et al, 2018) have also been proposed.…”
Section: Introductionmentioning
confidence: 99%
“…Whilst there are many different mechanisms for realising thermal rectification (Go & Sen, 2010;Roberts & Walker, 2011;Boreyko & Chen et al, 2011Chen et al, 2012;Ben-Abdallah & Biehs, 2013;Dos Santos Bernardes, 2014;Bairi et al, 2014;Pei et al, 2017;Blet et al, 2017;Avanessian and Hwang, 2018;Traipattanakul et al, 2019;Wong et al, 2019) in a variety of different geometric forms and orientations, the present study is concerned with PLVTDs. These devices (see Figures 1 and 2) essentially consist of two parallel plates of area A=yz separated by a cavity of depth x which contains a quantity of working fluid maintained in a thermodynamic state close to saturation.…”
Section: Thermal Diodesmentioning
confidence: 99%
“…[23][24][25][26][27][28][29] Recently, thermal rectification through solid-liquid (S-L) interfaces has been proposed, wherein the thermal rectification can be manipulated by varying the temperature and pressure of the system. [30][31][32][33][34][35][36][37] In Ref. [30], the thermal rectification phenomenon has been reported in an interfacial system with water and self-assembled monolayers silica, which is caused by the strong temperature dependence of the hydrogen bonds in water.…”
Section: Introductionmentioning
confidence: 99%
“…Thermal rectification can also be achieved by varying the interfacial properties of the S-L interface, [31,32] applying an external force (electric or magnetic field) on the liquid molecules, [32] surface modifications with soft material, [31] different molecular mass between two artificial solid walls [33] or asymmetric molecular adsorption on the solid surface. [34][35][36] Although various thermal rectification models have been proposed, the thermal rectification effect in S-L systems is still limited, and the underlying mechanism for thermal rectification is still far from clarity.…”
Section: Introductionmentioning
confidence: 99%