Thermal Dissipation Approach Comparison and Evaluation for SiC Surface Mount Devices

Baker, V.; Fan, Boran; Knoll, Jack; Burgos, Rolando; Chen, Warren

doi:10.1109/ecce47101.2021.9595183

Cited by 7 publications

(1 citation statement)

References 12 publications

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“…SMD power MOSFETs are soldered directly onto the PCB surface, significantly reducing occupied space. However, due to their smaller exposed surfaces, their heat dissipation capabilities may be limited compared to through-hole MOSFETs, and adequate thermal management of the PCB is necessary to ensure efficient heat dissipation [14], [15].…”

Section: Introductionmentioning

confidence: 99%

Analytical electro-thermal model and 3-D thermal resistance network for SMD-based printed circuit board power converters

Piovesan,

Prado,

Sartori

et al. 2024

Preprint

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This work presents an analytical electro-thermal model for SMD-based printed circuit board (PCB) power converters. Temperature-dependent component losses are derived from analytical models and a 3-D thermal resistance network is employed to characterize the temperatures across components and PCB paths. Furthermore, the work explores the mechanical and thermal interaction within the PCB paths, concurrently analyzing semiconductor switches and the power inductor in synchronous commutation cell configurations. The proposed model undergoes evaluation with two different PCB layouts of a synchronous boost converter, operating at 350 kHz with 50 W and 75 W. Model-generated temperatures are compared with experimental measurements using a thermal imaging camera and with Finite Elements Analysis (FEA) in Ansys Icepak. The acquired results validate the accuracy of the proposed model.

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Section: Introductionmentioning

confidence: 99%