Thermal effusivity measurement based on analysis of 3D heat flow by modulated spot heating using a phase lag matrix with a combination of thermal effusivity and volumetric heat capacity

Ohta, Hiromichi; Hatori, Kimihito; Matsui, Genzou; Yagi, Takashi; Miyake, Shugo; Okamura, Takeo; Endoh, Ryo; Okada, Ryo; Morishita, Keisuke; Yokoyama, Shin-ichiro; Taguchi, Kazunori; Kato, Hidemi

doi:10.1088/0957-0233/27/11/115002

Cited by 12 publications

(17 citation statements)

References 28 publications

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“…Figure 1 shows the schematic model of the thermoreflectance method for numerical calculation, which is based on previous studies. (23,24) This model consists of two layers of solids and air. The subscripts 0, 1, and 2 denote the air, the Mo layer, and the sample layer, respectively.…”

Section: Methodsmentioning

confidence: 99%

“…The principle of the calculation method considering the relationship between the volumetric heat capacity and the thermal effusivity is described in related previous papers. (23,24) Thus, only the key points of the calculation method are described below.…”

Section: Calculation Principlementioning

confidence: 99%

“…These values are taken from previous studies. (23,24) Note that the thermal conductivity of the Mo film can be controlled by adjusting the sputtering conditions such as the kind of gas for plasma generation, gas pressure, back pressure, and substrate temperature. In particular, the thermal diffusivity is strongly affected by these parameters.…”

Section: Numerical Calculationmentioning

confidence: 99%

“…The behavior of the thermoreflectance signal in periodic modulation heating has been studied by numerical calculation and experiments. (22)(23)(24) These studies revealed the characteristics of the thermoreflectance signal as a temperature response at the center of the heating spot as a three-dimensional heat conduction equation in the cylindrical coordinate system. However, without the correct values of the thermal and physical properties of the reflector material under initial conditions, that is, the thermal conductivity (λ), specific heat (C), and density (ρ), it is impossible to solve the problem precisely.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Effusivity Calibration Procedure for Thermal Microscope

Miyake¹,

Ohtsuki²,

Awano³

et al. 2019

Sensors and Materials

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In this paper, a thermal effusivity calibration procedure is proposed using a numerical calculation and measurement of a phase lag of a thermoreflectance signal based on a periodic modulation thermoreflectance method for a thermal microscope. To improve the accuracy of the estimated thermal effusivity, the profile determination of the heating and probing laser beams and the numerical calculation of phase lags with a two-layer model in a threedimensional heat conduction equation are carried out. Results of the experiments of beam profile determination and numerical calculation showed that the estimated values of thermal effusivities are in good agreement with the standard values of silicon, germanium, and Pyrex ® samples. We are convinced that the use of a thermal microscope with numerical calibration is becoming an accurate and precise thermal property measurement technique for the microscale range.

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Section: Methodsmentioning

confidence: 99%

Section: Calculation Principlementioning

confidence: 99%

Section: Numerical Calculationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Thermal Effusivity Calibration Procedure for Thermal Microscope

Miyake¹,

Ohtsuki²,

Awano³

et al. 2019

Sensors and Materials

Self Cite

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show abstract

“…Figure 2 shows the TM apparatus, which is described in detail in Ref. 12. Detailed information on typical TM and data processing for determining the thermal effusivity at one point of a sample is available in our previous publication; (13) only a brief outline is provided here.…”

Section: Thermal Effusivity Measurementsmentioning

confidence: 99%

Annealing Cycle Dependence of Thermal Conductivity for Si-Ge-Au Thin Film Analyzed by Thermal Microscopy

Nishi¹,

Mayama²,

Ohta³

2019

Sensors and Materials

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The thermal effusivity of a Si-Ge-Au thin film was measured using a thermal microscope. A thin-film sample with sixty-seven artificial intervals each comprising Si (2.0 nm)/Au-doped Ge (2.5 nm) was prepared and annealed more than 20 times. The dependence of the thermal conductivity of the film on the number of annealing cycles was determined using the obtained experimental thermal effusivity data, bulk density, and specific heat capacity. The film thickness (~300 nm) was greater than the thermal diffusion length of the samples. The thermal conductivity of the Si-Ge-Au thin film was satisfactory considering the number of annealing cycles. Thus, we elucidated the annealing effect of thermal conductivity for the Si-Ge-Au thin film.

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Determination of Thermal Effusivity of Lunar Regolith Simulant Particle Using Thermal Microscopy

et al. 2022

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This study aimed to measure the thermal effusivity distribution on a lunar regolith simulant (FJS-1) using a thermal microscope and to calculate the average thermal effusivity and thermal conductivity using density and specific heat. Moreover, discussions were conducted based on the results of the microstructural analysis of the sample. The FJS-1 particles were embedded in an epoxy resin and polished to a mirror finish. The samples were analyzed using scanning electron microscopy equipped with energy-dispersive X-ray spectroscopy (SEM–EDS). X-ray diffraction (XRD) was performed to identify the mineral phases in FJS-1. The results of SEM–EDS and XRD showed that a single sand particle was composed of several minerals, such as anorthite and olivine. Then, the thermal microscope was used to obtain the distribution of the thermal effusivity of a particle from the mirror-finished sample in a 1 × 1 mm2 area with intervals of 10 μm. The measured thermal effusivity correlates with the SEM image of the sample. Anorthite has a small thermal effusivity of 1.99 ± 0.31 kJ·s−0.5·m−2·K−1, while olivine has a large thermal effusivity of 2.73 ± 0.35 kJ·s−0.5·m−2·K−1. In both cases, the thermal effusivity was found to be of the same order of magnitude as the reported values. The average thermal effusivity and conductivity of a single particle were determined to be 2.4 ± 0.6 kJ·s−0.5·m−2·K−1 and 2.6 ± 1.3 W m−1·K−1, respectively, based on the proportion of existing phases.

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Thermal effusivity measurement based on analysis of 3D heat flow by modulated spot heating using a phase lag matrix with a combination of thermal effusivity and volumetric heat capacity

Cited by 12 publications

References 28 publications

Thermal Effusivity Calibration Procedure for Thermal Microscope

Thermal Effusivity Calibration Procedure for Thermal Microscope

Annealing Cycle Dependence of Thermal Conductivity for Si-Ge-Au Thin Film Analyzed by Thermal Microscopy

Determination of Thermal Effusivity of Lunar Regolith Simulant Particle Using Thermal Microscopy

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