Thermal-Electric-Mechanical coupling simulation of Cu Pillar Bumps under AC current

Li, Kai; Fu, Zhiwei; Chen, Si; Li, Guoyuan; Xu, Jile

doi:10.1109/nemo49486.2020.9343457

Cited by 2 publications

(1 citation statement)

References 6 publications

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“…Li researched the electromigration of Cu pillar bumps under AC conditions. The thermal-electric-mechanical coupling simulation was realized by using the direct coupling element of ANSYS [51].…”

Section: Electro-thermal Couplingmentioning

confidence: 99%

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

Wang,

Liu,

Huo

et al. 2024

Micromachines

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With the advancement of Moore’s Law reaching its limits, advanced packaging technologies represented by Flip Chip (FC), Wafer-Level Packaging (WLP), System in Package (SiP), and 3D packaging have received significant attention. While advanced packaging has made breakthroughs in achieving high performance, miniaturization, and low cost, the smaller thermal space and higher power density have created complex physical fields such as electricity, heat, and stress. The packaging interconnects responsible for electrical transmission are prone to serious reliability issues, leading to the device’s failure. Therefore, conducting multi-field coupling research on the reliability of advanced packaging interconnects is necessary. The development of packaging and the characteristics of advanced packaging are reviewed. The reliability issues of advanced packaging under thermal, electrical, and electromagnetic fields are discussed, as well as the methods and current research of multi-field coupling in advanced packaging. Finally, the prospect of the multi-field coupling reliability of advanced packaging is summarized to provide references for the reliability research of advanced packaging.

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Section: Electro-thermal Couplingmentioning

confidence: 99%